Scalable power modules from digital to 5G
Flex designs and manufactures scalable power supply solutions that improve the operational efficiencies of advanced data center, IT information and communications networks. It is also being used in several other segments including industrial, transportation, medical military and avionics. Flex Coldwatt™ products provide a complete on-board system solution for cloud, storage and server applications. Coldwatt products address customer challenges while delivering superior quality, cost and performance at scale.
Superior performance characteristics
Flex Coldwatt product families follow Intel’s Common Redundant Power Supply (CRPS) form factor and features, and power most common electronic devices such as microprocessors, DSPs, FPGAs, GPUs, memory and storage, delivering enhanced performance, energy management and end-user value.
Key characteristics of Flex power modules include:
- Class-leading high efficiency of up to 96.6%
- Deliver power from 1.5W upto >1000W
- Tightly regulated 36-75V output for telecom and 40-60V input voltage range for Datacom applications, wide input voltage range for Industrial and transport applications, 9-36V, 18-75V, 66-160V
- Maximum output of 480A for Point of Loads in parallel mode and 120A maximum output in single mode
- Maximum output current of 20A for Power Interface Modules
- Output current monitoring of +/-1A to enable highly accurate system monitoring capability
- Rapid transient recovery time as fast as 1 millisecond
- Mean time between failures as high as 8.2 million hours
- I/O functional isolation of up to 2250Vdc, which meets the IEC/EN/UL60905 safety standard and IEC62368
- Flex Power Designer adds simulation tools supporting high-current architectures, improving efficiency, filter and loop compensation and parameter settings
BMR 451 Series
Parallel Operation - PKM 4817LNH
The PKM 4817LNH offers passive load sharing allowing multiple products to be connected in parallel. This feature is typically used to increase power output on the same rail, providing redundancy against a product failure, or distribute thermal heat over a larger board area. Paralleling may also aid in streamlining your Bill of Materials by replacing the need for separate products with higher power requirements.
LGA Design and Assembly Considerations
LGA (Land Grid Array) is a connection method with a grid of contact pads on the connection side of the PCB. The grid of contacts consists of pads without any pre-deposit of solder. Interconnection between an LGA module and a connecting PCB is achieved by printing solder paste on the connecting PCB which will meltduring the reflLow process and create a solder interconnection between the module and connecting PCB.
Snapshot Parameter Capture – 3E PoL Regulators
The snapshot function enables the user to read comprehensive information of device status and parameters via a single PMBus read transaction. The snapshot function also makes it possible to automatically capture the same parametric data in response to a pending fault, and store that data to Non-volatile Memory (NVM). This can be of great value when making a root cause analysis of a fault situation.
Repair and Rework Recommendations for Flex Power Modules
In case that a module needs to be replaced on the hosting board, recommended processes and guidelines described in this section should be applied. Instructions are listed after fundamental principles and recommendations for rework processes for power modules.
Output Filter Impedance Design - 3E POL Regulators
The 3E Digital products can be configured, controlled and monitored through a digital serial interface using the PMBus™ power management protocol. This application note provides information on how to design the output filter impedance of 3E POL regulators.
In-System Programming Guide – 3E Series Power Modules
This application note provides information on communicating with Flex 3E Series Digital Power Modules while they are already placed “in-system”. Specifically, we discuss what changes are available while the power output is enabled, referred to as Operation Changes. We also guide through designing your power system to support in-system configuration updates - allowing you to potentially configure parts without the need of ordering pre-configured products or using a contract manufacturer.
Input Filter Design - 3E POL Regulators
The 3E Digital products can be configured, controlled and monitored through a digital serial interface using the PMBus™ power management protocol. This application note provides information on how to design input filters for the 3E POL regulators.
Synchronization and Phase Spreading - 3E POL Regulators
The 3E Digital products can be configured, controlled and monitored through a digital serial interface using the PMBus™ power management protocol. This application note provides information on how to synchronize the 3E POL regulators and use phase spreading for optimized performance.
First and Second Generation 3E POL Regulators - A Comparison
This document provides an overview of the differences and compatibility between the first and second generation of 3E digital point-of-load (POL) regulators. This useful information applies both when considering the choice of regulator for a new design and when updating BMR450/451 with BMR462/463/464 in an existing design.
Sequencing Configuration – 3E POL Regulators
The 3E Digital products can be configured, controlled and monitored through a digital serial interface using the PMBus™ power management protocol. This application note provides information on different methods for sequencing of the 3E POL regulators.
Test Methods for DC/DC Power Modules
This design note addresses techniques and considerations for accomplishing such testing, and should be used in conjunction with the Technical Specification for the particular product being evaluated as well as other Flex design notes that will be referenced. Contents include precautions that should be kept in mind when testing DC/DC power modules, the appropriate test setup and test equipment, and a procedural outline for performing many of the most common types of tests. By following the guidelines presented here, valid test results that may be compared to the parameters listed in the product Technical Specification will be obtained.
Thermal Characterization of Board Mounted Power Supplies in Sealed Box Applications
This design note describes the thermal performance of board mounted power supplies when used in applications with no or limited convection cooling. In these condition, oftenreferred to as ‘sealed box’ applications, the main part of the power losses is dissipated by conduction through the power supply’s baseplate coupled to a large thermal mass (cold wall).
Powering FPGAs Using Digitally Controlled Point of Load Converters
Field Programmable Gate Arrays (FPGAs) require several high quality power supply lines. Designers experience several challenges when designing FPGA power solutions which are elaborated in this design document. All of these challenges are much easier to accommodate when using digital power technology. Moreover, using digitally-controlled DC/DC converters dramatically reduces the time taken to design the FPGA’s power supply system.
Conducted EMC Filters for Flex Board Mounted Power Supplies
This design note is intended to alleviate confusion regarding EMC requirements by showing how Flex board mounted power supplies, BMPS, can be easily integrated into a wide range of electronic systems while meeting the system level EMC requirements.
Selection of Architecture for Systems Using Bus Converters and POL Converters
Most telecom and datacom systems now contain integrated high performance processors, ASICs and FPGAs. These systems are characterized by high levels of current demand at multiple low supply voltages, tight regulation requirements, large and fast dynamic currents. This environment leads to the utilization of some type of distributed power architecture (DPA) to supply operating voltages to these circuits rather than using centralized power architecture.
DC/DC Power Modules Basics
This design note covers basic considerations for the use of on-board switch mode DC/DC power modules, also commonly known as BMPS, i.e. board mounted power supplies.
Forced Air Cooling of DC/DC Power Modules at High Altitude
Due to lower air density at higher elevations, the convective heat transfer capabilities of air can vary depending on elevation. For uncontrolled environment this adverse effect is offset by a lower ambient temperature at higher elevations. This Design Note will focus on the relationship between air convective heat transfer and elevation. This should be considered within the context of cooling DC/DC converters and their associated thermal derating curves.
Highly customized node and rack level product solutions configured for local markets. Build converged architectures for security, data storage and analytics.
Flexible data centers for a connected world. Find out how you can partner with Flex to optimize your infrastructure and design the cloud solution that's right for you.