System in Package: Integrated Alarm System (IAS)

Through a collaboration with Infineon and QuickLogic, we developed IAS, the most intelligent and reliable glass break sensor on the market. With our System in Package (SiP) expertise, we integrated miniaturized and integrated form factor through our proprietary packaging process.

Learn how IAS can detect glass break and intrusion in an assortment of environments — all with a low barrier for integration and low unit cost.

Features and benefits

• System in Package (SiP) — Miniaturized and integrated form factor through Flex proprietary packaging process
• Factory configured with Infineon’s IAS algorithm
• Self contained subsystem that frees host processor from IAS sensor fusion workloads
• Low barrier for integration in new or existing products
• Lowest unit cost

Key components for integrated sensors and compute module

• QuickLogic EOS S3 — ARM Cortex M4-F up to 80Mhz with 512KB SRAM
• 8mb SPI flash
• Infineon DPS310 — Digital Barometric Pressure
• Infineon IM69D130 — Digital MEMS Microphone

Download the data sheet