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Flex Resources Modular Compute Platform: AI & HPC solutions for modern data centers

Modular Compute Platform: AI & HPC solutions for modern data centers

Posted on
October 9, 2024
Solution Brief Cloud Data Center

Flex delivers advanced manufacturing, data center IT and power infrastructure solutions from the grid to the chip, and product lifecycle services to address industry-wide challenges with power, heat, and scale. The new Flex Modular Compute Platform is an integral part of this portfolio.

The customizable, open standard-based, compute platform integrates SmartPlate™ a direct-to-chip liquid cooling solution from JetCool® to support the most challenging AI-enabled and High-Performance Computing (HPC) applications. This platform complies with the Open Compute Project (OCP) DC-MHS 2.0 specification and features a Host Processor Module (HPM) that supports up to two Intel® Xeon® 6900 series with P-cores, the latest generation of data center processors from Intel.

Advanced cooling for data centers 

JetCool’s patented Microconvective Cooling® technology extends the value of single-phase direct-to-chip liquid cooling solutions and provides more than enough headroom to accommodate the most demanding AI workloads.

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Key benefits include:

  • Superior cooling performance at up to 1200W per HPM 
  • Decrease in-system fan speeds to reduce energy usage up to 4kW per rack 
  • Improve processor efficiency and lifetime by maintaining optimal operational temperatures
  • Future-proof investments by supporting next-generation processors with SmartPlate cold plates that can cool up to 1,500W per chip 

Flexible customization for maximum versatility 

The Flex Modular Compute Platform features an innovative I/O expansion design that provides front access to the maximum number of PCIe 5.0 lanes from the host processors.

Liquid cooled modular compute platform

This flexible and customizable platform features support for up to nine add-in cards, including:

  • Front-access PCIe expansion slots that can support up to two double-wide GPU slots and two add-in cards (AIC), or a high-density configuration that supports up to six full-height half-length (FHHL) AICs
  • Front-access for two FHHL PCIe 5.0 x16 expansion slots in a butterfly configuration 
  • An OCP 3.0 mezzanine card (PCIe 5.0 x16) 

This platform also offers versatility with support for HPMs and add-in cards that comply with open standards-based specifications, including: 

  • OCP 2OU form factor enclosure 
  • HPM design that complies with DC-MHS 2.0 
  • Add-in network card slot that complies with OCP NIC 3.0 
  • Flex Secure Module provides system management functions and complies with DC-SCM 2.0 

The Flex Modular Compute Platform stands as a testament to our commitment to innovation and efficiency in the ever-evolving landscape of data centers.  

By addressing critical challenges such as cooling performance, energy efficiency, and system versatility, this platform not only meets the demands of today’s AI and HPC applications but also prepares businesses for future advancements. With its open standards-based design and robust features, companies are empowered to maximize their investments, ensuring they remain competitive and agile in a rapidly changing technological environment.  

As we continue to support our customers with scalable solutions, we are excited to lead the way in transforming data center operations for a sustainable and high-performance future.

Read the solution brief