Rob Campbell is President of Communications, Enterprise and Cloud at Flex. In this capacity, he leads the organization that supports leading cloud, data center operators, and communication solutions providers to fuel the expansion of next-generation AI data centers, enterprises and communication networks. In the data center space this includes hyperscalers, data center operators, colocation companies, and the solution providers that support them, including silicon manufacturers, OEMs, and others.

In the eight years prior to this role, Mr. Campbell lead the commercialization and growth of the Component Services and Infinex business units, before later assuming the role of President of Consumer Devices.

Prior to his time at Flex, Mr. Campbell started his career at Texas Instruments and Advanced Micro Devices in technical sales management roles. He joined Flex from Future Electronics, a multi-billion-dollar electronics distributor, where he was a Corporate Vice-President.

Mr. Campbell received his Bachelor of Science in Electrical Engineering from the University of Florida and completed the Executive Education program at Stanford Graduate School of Business.