Blog
October 11, 2024
Five insights: Power, liquid cooling, and IT infrastructure solutions for AI data centers
Rob Campbell is president of the Communications, Enterprise and Cloud business at Flex, the advanced, end-to-end manufacturing partner of choice that helps market-leading brands design, source, build, deliver, and manage products that improve the world.
In this capacity, he leads the organization that supports leading cloud, data center operators, and communication solutions providers to fuel the expansion of next-generation Al data centers, enterprises, and communication networks. In the data center space this includes hyperscalers, data center operators, colocation companies, and the solution providers that support them, including silicon manufacturers, OEMs, and others.
In the eight years prior to this role, Mr. Campbell led the commercialization and growth of Component Services and Infinex, before later assuming the role of president of the Consumer Devices Business.
Prior to his time at Flex, Mr. Campbell started his career at Texas Instruments and Advanced Micro Devices in technical sales management roles. He joined Flex from Future Electronics, a multi-billion-dollar electronics distributor, where he was a corporate vice president.
Mr. Campbell received his Bachelor of Science in electrical engineering from the University of Florida and completed the Executive Education program at Stanford Graduate School of Business.