Advanced engineering solutions

Through all possible scenarios and conditions, you need to know your product works as intended. We perform reliability testing at both the component and final product levels to reduce setbacks and delays.

We test your product in environmental chambers that simulate temperature, humidity, salt spray, ultraviolet rays, lighting, and drop and abrasion testing. We use contemporary techniques such as CT scan X-Ray, Shadow Moiré and SEM.

We’ll miniaturize the microelectronics within your product and prepare it to scale. Our technical capabilities include high-density SMT and fine-pitch flip chip, precision die attach and wire bonding, and robust encapsulation techniques with an emphasis on thermal management, miniaturization, size reduction and performance enhancement.

Our experience with system in package (SiP) gives you miniaturized design, better functionality and faster time to market.

Some of the most innovative products, such as textiles and wearables, demand elegance without sacrificing functionality. Sensors and stretchable electronics make applications such as health monitoring, temperature management and energy harvesting possible.

We develop technology know-how and processes to integrate material, electronics and stretchable substrates into clothing, fabrics and other advanced products.