Case Study
Smart parking systems — saving time, effort, and fuel
Our System in Package (SiP) sensor fusion allows you to do more in a smaller form factor. By managing multiple dies in the same package, you get a compact sensor node design that provides higher performance and lower total system cost.
Learn how our proprietary packaging process offers you a low barrier for integration for your new or existing product.
Features and benefits
- System in Package (SiP) — Miniaturized and integrated form factor through Flex proprietary packaging process
- Self contained subsystem that frees host processor from sensor fusion workloads
- Low barrier for integration in new or existing products
Key components for integrated sensors and compute module
- QuickLogic EOS S3 — ARM Cortex M4-F up to 80Mhz with 512KB SRAM
- 64mb SPI flash
- Infineon DPS310 — Digital Barometric Pressure
- Infineon IM69D130 Digital MEMS Microphone
- ST LSM6DSO — 6-axis IMU
Interfaces
UART interfaces for debug, flashing, alarm conditions, raw sensor data
GPIOs: configurable for communication, control, test, alarm conditions
Flash Direct Access
SWD interface for debugging
Power
Operational Power Supply: 1.8V-3.3V
