Sealed, direct-to-chip cooling unlocks higher performance and efficiency with no facility water or data center retrofits required
JetCool, a Flex (NASDAQ: FLEX) company and leading provider of advanced cooling for AI and high-density computing, has announced the launch of its SmartPlate™ System for Dell PowerEdge R770 and R7725 servers. Designed to help enterprises and edge operators achieve more compute density per rack, the direct-to-chip solution supports next-generation platforms powered by next-generation processors.
SmartPlate systems are proven to deliver an average 13% IT power reduction, helping maximize power and floor space in new builds and existing facilities. Fully sealed and ready to install, the system improves thermal performance without facility water or data center retrofits, providing a fast, low-disruption way to adopt direct-to-chip cooling in enterprise data centers and distributed edge locations.
“SmartPlate Systems deliver real results at scale,” said Dr. Bernie Malouin, Founder of JetCool and Vice President at Flex. “By bringing SmartPlate support to Dell PowerEdge R770 and R7725 servers, we’re giving enterprises and edge operators a faster path to higher rack density and better efficiency, without requiring changes to existing facilities.”
“With firsthand experience deploying the SmartPlate System, we’ve seen how it enables direct-to-chip liquid cooling within traditional air-cooled data centers,“ said John Sasser, Chief Technology Officer at JetCool partner Sabey Data Centers, one of the largest privately owned data center providers in the United States. “Using a closed-loop design, it integrates directly into the server, allowing fast, phased deployment. SmartPlate System helps improve server performance and reduce power consumption, giving customers a practical way to increase compute density and maximize their electricity and space budgets.”
Availability and Live Demo Locations
Available today, SmartPlate Systems for PowerEdge R770 and R7725 servers are helping organizations increase capacity, reduce energy costs, and advance sustainability goals without reworking facility infrastructure. Live demos are available at Dell Customer Solution Centers in Round Rock, Texas, and Singapore, as well as at Equinix facilities, Sabey Data Centers, and Telehouse London. JetCool will also showcase its latest solutions at booth 407 during Dell Technologies World, May 18–21, 2026, at the Venetian Expo in Las Vegas. Additional information is available at jetcool.com/dell.
About Flex
Flex (Reg. No. 199002645H) is the manufacturing partner of choice that helps leading brands design, build, and manage products that improve the world. With a global footprint spanning 30 countries, Flex delivers advanced manufacturing and supply chain solutions, innovative products and technology, and lifecycle services that support customers from concept to scale. In the AI era, Flex is helping customers accelerate data center deployment by solving power, heat, and scale challenges through cutting-edge power and cooling technology and scalable IT infrastructure solutions.
For information about Flex’s intent to spin off its Cloud and Power infrastructure portfolio, visit: https://investors.flex.com/transaction-resources/default.aspx.
About JetCool
JetCool, a Flex company, is a global leader in advanced thermal management for compute-intensive applications. Trusted by top chipmakers, OEMs, and data centers, JetCool delivers a portfolio of liquid cooling solutions that enhance performance, increase energy efficiency, and support sustainability goals. Engineered for the demands of artificial intelligence (AI) and next-generation computing, JetCool’s technologies deliver reliable, scalable performance for data centers around the world.