
The shift to high-power AI workloads is here, and it comes with the need for secure, scalable, and integrated infrastructure solutions — including advanced liquid cooling solutions capable of dealing with the immense heat produced by dense, power-hungry megawatt racks. Cooling distribution units (CDUs) are critical defenders of servers, processors, and other heat-generating equipment in today’s data centers.
In this eBook, you’ll learn how to evaluate the performance of these critical data center components to determine which CDU is right for your application and how the JetCool SmartSense CDU stacks up in terms of effectiveness, reliability, and suitability for specific cooling requirements.
- Cooling capacity
- Approach temperature difference
- Flow rate
- Pressure head
- Cooling load density
- Temperature range
High-performance workloads drive need for liquid cooling in data centers

As computing demands surge due to generative artificial intelligence (GenAI), high-performance computing (HPC), and cloud workloads, traditional air cooling in data centers is increasingly unable to meet the thermal and efficiency requirements of accelerated computing. Modern processors and AI Accelerators generate significantly more heat, especially as rack densities surpass 100 kW per rack. The adoption of next-generation GPUs, such as the NVIDIA Blackwell B200 Tensor Core GPU with a thermal design power of 1,200 W, requires liquid cooling to keep these GPUs within safe operating temperatures.
This is particularly true in large-scale AI server deployments, where thermal and energy demands are pushing existing infrastructure to its limits. For example, the NVIDIA NVL72 rack system, which is based on the B200 GPU, requires 120 kW per rack today, with a roadmap for 600 kW in 2027. Liquid cooling, with its far superior thermal conductivity, can efficiently remove heat from high-density racks, making it a preferred choice in many AI data centers.