This glossary provides definitions for key terms used in power electronics, DC/DC conversion, data center power architectures, AI compute systems, and digital power management. It supports engineers, system architects, and developers working with advanced power delivery solutions, including 48 VDC and 800 VDC architectures, OCP standards, and high-efficiency board solutions.
0-9
- 1PIC – Single Phase Immersion Cooling
- 2G – Second Generation (GSM/D-AMPS/GPRS/Edge)
- 2PIC – Two Phase Immersion Cooling
- 3D – Three Dimensional
- 3DIC – 3D Integrated Circuit
- 3E – Enhanced performance, Energy management, End-user value
- 3G – Third Generation (UMTS/CDMA2000/HSPA/HSPA+/EVDO)
- 3GPP – Third Generation Partnership Project
- 4G – Fourth Generation (LTE/LTE-A/LTE-Pro)
- 4PPOE – 4-Pair Power Over Ethernet
- 5G – Fifth Generation (NR)
- 8D – 8 Disciplines (report)
A
- A/D – Analog to Digital
- AAA – Authentication, Authorization and Accounting
- AALC – Air Assisted Liquid Cooling
- AAS – Advanced or Active Antenna System
- AAU – Active Antenna Unit
- AC – Alternating Current
- AC/DC – Alternating Current to Direct Current
- ACAP – Adaptive Compute Acceleration Platform
- ACK – Acknowledgement
- ACL – Access Control List
- ACP – Average CPU Power
- ACS – Active Current Sharing or American Chemical Society
- ADC – Analog to Digital Converter
- ADM – Add/Drop Multiplexer
- ADSL – Asymmetrical Digital Subscriber Line
- AFU – Antenna Filter Unit
- AGC – Automatic Gain Control
- AGI – Artificial General Intelligence
- AGV – Automated Guided Vehicle
- AI – Artificial Intelligence
- AIDC – Artificial Intelligence Data Center
- AISG – Antenna Interface Standards Group
- AMC – Advanced Mezzanine Card
- AMH – Automated Material Handling
- AMP – Architects of Modern Power or Amplifier
- AMR – Autonomous Mobile Robot
- ANI – Artificial Narrow Intelligence
- ANN – Artificial Neural Network
- ANSI – American National Standards Institute
- AOI – Automated Optical Inspection
- AON – Active Optical Network
- AP – Access Point
- API – Application Programming Interface
- APL – Approved Parts List
- APM – Advanced Power Management
- APQP – Advanced Product Quality Planning
- APT – Average Power Tracking
- APU – Accelerated Processing Unit
- AR – Augmented Reality
- ART – Adaptive Ramp Time
- AS – Access Server
- ASCR – A Single Cycle Response
- ASI – Artificial Super Intelligence
- ASIC – Application Specific Integrated Circuit
- ASIL – Automotive Safety Integrity Level
- ASM – Advanced Sleep Mode
- ASRS – Automated Storage and Retrieval Systems
- ASSP – Application Specific Standard Product
- ATCA – Advanced Telecommunications Computing Architecture
- ATE – Automated Test Equipment
- ATM – Asynchronous Transfer Mode
- ATS – Automatic Transfer Switch
- AVA – Analog Voltage Adjust
- AVL – Approved Vendor List
- AVS – Adaptive Voltage Scaling
- AVSBus – Adaptive Voltage Scaling Bus
- AWG – American Wire Gauge
- AWS – Amazon Web Services
- AXI – Automated X-ray Inspection
B
- BAC – Broadband Access Controller
- BBU – Baseband Unit or Battery Backup Unit
- BCM – Business Continuity Management
- BCP – Business Continuity Plan
- BEM – Boundary Element Method
- BER – Bit Error Rate
- BESS – Battery Energy Storage System
- BFN – Beam Forming Network
- BGA – Ball Grid Array or Bump Grid Array
- BJT – Bipolar Junction Transistor
- BMC – Baseboard Management Controller
- BMP – Board Mounted Power
- BMPS – Board Mounted Power Supply
- BMR – Board Mounted Regulator
- BMS – Battery Management System or Building Management System
- BNG – Broadband Network Gateway
- BoM – Bill of Materials
- BPD – Backside/Bottomside Power Delivery
- BPR – Buried Power Rail
- BRAS – Broadband Remote Access Server
- BREP – Boundary Representation
- BSC – Base Station Controller
- BSI – British Standards Institute
- BSPDN – Backside Power Delivery Network
- BSS – Base Station System
- BTS – Base Transceiver Station
- BW – Bandwidth
C
- C-RAN – Centralized/Cloud Radio Access Network
- C2C – Chip-to-Chip Interconnect
- CA – Controller Assembly
- CAD – Computer Aided Design
- CAGR – Compound Annual Growth Rate
- CAN – Controller Area Network (bus)
- CAN FD – Controller Area Network Flexible Data-rate
- CAS – Chemical Abstracts Service (number)
- CAVs – Connected and Autonomous Vehicles
- CB – Certification Body
- CBC – Cycle By Cycle (protection)
- CC – Constant Current
- CCC – China Compulsory Certification
- CCM – Continuous Conduction Mode
- CDA – PMBus Configuration Data File
- CDM – Coolant Distribution Manifold
- CDMA – Code Division Multiple Access
- CDN – Content Delivery Network
- CDP – Carbon Disclosure Project
- CDR – Critical Design Review
- CDU – Coolant Distribution Unit
- CE – Conformité Européenne or Customer Edge
- CEM – Contract Electronics Manufacturer
- CEN – Comité Européen de Normalisation
- CENELEC – Comité Européen de Normalisation Électrotechnique
- CESS – Capacitive Energy Storage System
- CFD – Computational Fluid Dynamics
- CFM – Cubic Feet per Minute (airflow)
- CFP – Common FootPrint
- CIF – Co-Innovation Facility
- CM – Common Mode (noise/choke)
- CMC – Current Mode Control
- CMOS – Complementary Metal Oxide Semiconductor
- CMRR – Common Mode Rejection Ratio
- CMRT – Conflict Minerals Reporting Template
- CMTI – Common Mode Transient Immunity
- CNN – Convolutional Neural Network
- CoC – Certificate of Conformance
- CoD – Chip-on-Die
- CoO – Country of Origin
- COS – Continuity of Supply
- COT – Constant On Time
- COTS – Commercial Off The Shelf
- CoWoS – Chip-on-Wafer-on-Substrate
- CPA – Centralized Power Architecture
- CPE – Compute Power Efficiency
- CPE – Customer Premises Equipment
- CPO – Co‑Packaged Optics
- CPU – Central Processing Unit
- CQC – China Quality Certification
- CRAC – Computer Room Air Conditioning
- CRAH – Computer Room Air Handling
- CSA – Canadian Standards Association
- CSP – Communication Service Provider
- CSS – Compute Subsystem
- CSV – Comma Separated Values
- CTBP – Control, Transport, Baseband, and Power
- CTI – Comparative Tracking Index
- CTW – Cooling Tower Water
- CU – Centralized Unit
- CUDA – Compute Unified Device Architecture
- CUE – Carbon Usage Effectiveness
- CV – Constant Voltage
- CWDM – Coarse Wavelength Division Multiplexing
- CXL – Compute eXpress Link
D
- D-AMPS – Digital Advanced Mobile Phone System
- D/A – Digital to Analog
- D2C – Direct to Chip (liquid cooling)
- D2D – Direct-to-Die
- DAC – Digital to Analog Converter
- DAP – Delivered At Place
- DAS – Distributed Antenna System or Direct Attached Storage
- DBF – Digital Beam Forming
- DBV – Dynamic Bus Voltage
- DC – Direct Current
- DC/AC – Direct Current to Alternating Current (inverter)
- DC/DC – Direct Current to Direct Current (converter)
- DCCM – Data Center Cooling Management
- DCIM – Data Center Infrastructure Management
- DCL – Decision Logic or Data Control Language
- DCM – Discontinuous Conduction Mode
- DCR – Direct Current Resistance (measurement)
- DCS – Distributed Control System
- DCX – DC Transformer
- DDP – Delivered Duty Paid
- DDR – Double Data Rate (memory)
- DEM – Diode Emulation Mode
- DFC – Direct Frequency Control
- DFE – Design For the Environment
- DFM – Design For Manufacturability
- DFMEA – Design Failure Mode and Effects Analysis
- DFR – Design For Reliability
- DFT – Design For Testability
- DiCon – Direct Conversion
- DIL – Dual InLine (package)
- DIMM – Dual Inline Memory Module
- DIN – Deutsches Institut für Normung
- DIP – Dual Inline Package
- DL – Deep Learning
- DLA – Deep Learning Accelerator
- DLC – Dynamic Load Compensation or Direct Liquid Cooling
- DLS – Droop Load Sharing
- DMUX – Demultiplexer
- DOE – Design of Experiments
- DOSA – Distributed-power Open Standards Alliance
- DOW – Date Of Withdrawal
- DPA – Distributed Power Architecture
- DPC – DIMMs Per Channel
- DPD – Digital Pre-Distortion
- DPI – Deep Packet Inspection
- DPM – Digital Power Management or Dynamic Power Management
- DPoL – Digital Point of Load (converter)
- DPU – Data Processing Unit
- DPWM – Digital Pulse Width Modulation or Discontinuous PWM
- DRAM – Dynamic Random Access Memory
- DrMOS – Driver & MOSFET module
- DRP – Disaster Recovery Plan
- DSL – Digital Subscriber Line
- DSLAM – Digital Subscriber Line Access Multiplexer
- DSM – Demand Side (Clock) Management
- DSO – Days Sales Outstanding
- DSP – Digital Signal Processor
- DTC – Direct to Chip (liquid cooling)
- DTC – Direct Torque Control
- DTI – Distance Through Insulation
- DU – Distributed Unit
- DUT – Device Under Test
- DVFS – Dynamic Voltage & Frequency Scaling
- DVS – Dynamic Voltage Scaling
- DVT – Design Validation/Verification Testing
- DWDM – Dense Wavelength Division Multiplexing
E
- E-mMIMO – Extreme-massive MIMO
- E&O – Excess and Obsolete
- E2E – End to End
- EAR – Export Administration Regulations
- EB – Eighth Brick
- EC – Engineering Change or Edge Computing
- ECA – Electronic Components Association
- ECCN – Export Control Classification Number
- ECHA – European CHemicals Agency
- ECIA – Electronic Components Industry Association
- ECN – Export Control Notice
- ECS – Environmental Control System
- EDA – Electronic Design Automation
- EDC – Electrical Design Current
- EDGE – Enhanced Data for Global Evolution
- EDI – Electronic Data Interchange
- EDP – Electrical Design Power or Excursion Design Power or Electronic Data Processing
- EDPP – Extreme Dynamic Power Profile
- EDR – Event Data Recorder (“black box”)
- EER – Envelope Elimination and Restoration
- EFT – Electrical Fast Transient
- EIA – Electronic Industries Association
- ELFR – Early Life Failure Rate
- ELV – Extra Low Voltage
- EMAC – Ethernet Media Access Control (address)
- eMBB – Enhanced Mobile BroadBand
- EMC – Electromagnetic Compatibility
- EMF – Electromotive Force or Electromagnetic Field
- EMI – Electromagnetic Interference
- EMIB – Embedded Multi-Die Interconnect Bridge
- EMR – Electromagnetic Radiation
- EMRT – Extended Minerals Reporting Template
- EMS – Electronic Manufacturing Services
- EN – Norme Européen or Engineering Note
- eNB – Evolved NodeB
- ENIG – Electroless Nickel Immersion Gold
- EOL – End Of Life
- EPC – Evolved Packet Core
- EPG – Evolved Packet Gateway
- EPO – Emergency Power Off
- EPON – Ethernet Passive Optical Network
- EPROM – Erasable Programmable Read Only Memory
- EPU – Energy Processing Unit
- ERE – Energy Reuse Effectiveness
- ERF – Energy Reuse Factor
- ERI – Early Return Index
- ERP – Enterprise Resource Planning
- ERTMS – European Rail Traffic Management System
- ESD – Electrostatic Discharge
- ESG – Environmental, Social, and Governance
- ESL – Equivalent Series Inductance
- ESR – Equivalent Series Resistance
- ESS – Environmental Stress Screening
- ET – Envelope Tracking
- ETA – Estimated Time of Arrival
- ETCS – European Train Control System
- ETD – Estimated Time of Departure
- EUT – Equipment Under Test
- EV – Electric Vehicle
- EVDO – Evolution Data Optimized
- EVT – Engineering Validation/Verification Testing
- EXW – Ex Works
F
- FAE – Field Application Engineer
- FAI – First Article Inspection
- FAQ – Frequently Asked Questions
- FAR – Failure Analysis Report
- FCA – Free Carrier
- FCC – Federal Communications Commission or Forced Continuous Conduction
- FCCM – Forced Continuous Conduction Mode
- FCF – Free Cash Flow
- FCT – Functional Circuit Test
- FDD – Frequency Division Duplex
- FDMA – Frequency Division Multiple Access
- FEA – Finite Element Analysis
- FEM – Finite Element Method or Front End Module
- FET – Field Effect Transistor
- FFC – Feed-Forward Compensation
- FFT – Fast Fourier Transform
- FHA – Fundamental Harmonic Analysis
- FIQ – Fast Interrupt reQuest
- FIT – Failures In Time
- FMD – Full Material Declaration
- FMEA – Failure Mode Effect Analysis
- FMPS – Fault Managed Power System
- FOB – Free On Board
- FPD – Flex Power Designer
- FPGA – Field Programmable Gate Array
- FPM – Flex Power Modules
- FRA – Fixed Radio Access
- FRMCS – Future Railway Mobile Communication Systems
- FRU – Field Replaceable Unit
- FSC – Fan Speed Control
- FTTx – Fiber To The “x” (Premise/Home/Building/Cabinet/Node etc.)
- FWA – Fixed Wireless Access
- FWS – Facility Water System
G
- GaAs – Gallium Arsenide
- GAE – Grid-Aware Efficiency
- GAM – Global Account Manager
- GaN – Gallium Nitride
- GCB – Group Communication Bus
- GCM – Global Commodity Management
- GCP – Google Cloud Platform
- GDT – Gas Discharge Tube
- GHG – Greenhouse Gas
- GigE – Gigabit Ethernet
- GMSL – Gigabit Multimedia Serial Link
- gNB – Next Generation NodeB
- GND – Ground
- GNN – Graph Neural Network
- GP-GPU – General Purpose Graphic Processing Unit
- GPA – General Purpose Agreement
- GPIB – General Purpose Interface Bus
- GPIO – General Purpose Input/Output
- GPON – Gigabit Passive Optical Network
- GPP – General Purpose Processor
- GPRS – General Packet Radio Service
- GPS – Global Positioning System
- GPT – Generative Pretrained Transformer model
- GPU – Graphic Processing Unit
- GSA – Global mobile Suppliers Association
- GSM – Global System for Mobile Communications
- GSM-R – GSM Railway
- GSMA – GSM Association
- GUI – Graphical User Interface
- GWP – Global Warming Potential
H
- HALT – Highly Accelerated Life Testing
- HASL – Hot Air Solder Level
- HASS – Highly Accelerated Stress Screening
- HAST – Highly Accelerated Stress Testing
- HB – Half Brick
- HBD – High Bandwidth Domain
- HBI – Hybrid Bonding Interface
- HBM – High Bandwidth Memory
- HCI – HyperConverged Infrastructure
- HDR – High Data Rate
- HEMT – High Electron Mobility Transistors
- HEV – Hybrid Electric Vehicle
- HIL – Hardware-in-the-Loop
- HIP – Head-In-Pillow (defect)
- HMI – Human Machine Interface
- HOD – High Ohmic Distribution
- HPC – High Performance Computing
- HPC-SoC – High-Performance Computing System-on-Chip
- HPCaaS – High Performance Computing as a Service
- HPDC – High Performance Data Center
- HPR – High Power Rack
- HRG – High Resistance Grounding
- HRMG – High Resistance Midpoint Grounding
- HRR – Hybrid Regulated Ratio
- HS – Harmonized System
- HSC – Hybrid Switched Capacitor (topology)
- HSDPA – High Speed Downlink Packet Access
- HSPA – High‑Speed Packet Access
- HTOL – High Temperature Operating Life
- HTS – Harmonized Tariff Schedule
- HTSL – High Temperature Storage Life
- HTTP – Hypertext Transfer Protocol
- HTTPS – Hypertext Transfer Protocol Secure
- HV – High Voltage
- HVAC – Heating, Ventilation, and Air Conditioning
- HVDC – High Voltage Direct Current (on-board / inside systems)
- HVDC – High Voltage Direct Current (power transmission)
- HW – Hardware
I
- I/O – Input/Output
- I2C – Inter‑Integrated circuit Communication (bus)
- I3C – Improved Inter‑Integrated circuit Communication
- IA – Intelligent Automation
- IBA – Intermediate Bus Architecture
- iBBU – Intelligent Baseband Unit
- IBC – Intermediate Bus Converter
- IBV – Intermediate Bus Voltage
- IC – Integrated Circuit
- ICS – Industrial Control Systems
- ICT – In-Circuit Test or Information & Communications Technology
- IDA – Inventory Deposit Agreement
- IDC – Internet Data Center
- IDM – Integrated Device Manufacturer
- IDS – Intrusion Detection System
- IDU – Indoor Unit
- IEC – International Electrotechnical Commission
- IEE – Institution of Electrical Engineers
- IEEE – Institute of Electrical and Electronic Engineers
- IET – Institution of Engineering and Technology
- IGBT – Insulated Gate Bipolar Transistor
- IHV – Independent Hardware Vendor
- IIoT – Industrial Internet of Things
- IKE – Internet Key Exchange
- IMDS – International Material Data System
- IMS – Insulated Metal Substrate or IP Multimedia Subsystem
- IMT – International Mobile Telecommunication
- IoE – Internet of Everything
- IOR – Input‑Output Ratio
- IoT – Internet of Things
- IoU – Intersection over Union
- IP – Internet Protocol or Intellectual Property or International Protection
- IPC – Institute for Printed Circuits
- IPMI – Intelligent Platform Management Interface
- IPS – Integrated Power Stage/Systems
- IPsec – Internet Protocol Security
- IPU – Image/Intelligence/Infrastructure Processing Unit
- IR – Infrared (Reflow)
- IRQ – Interrupt ReQuest
- IRR – Initial Return Rate
- ISA – Instruction Set Architecture
- ISO – International Organization for Standardization
- ISP – Infrastructure/Internet Service Provider
- ISV – Independent Software Vendor
- ITAR – International Traffic in Arms Regulations
- ITO – Inventory Turnover
- ITU – International Telecommunication Union
- IUCLID – International Uniform CHemicaL Information Database
J
L
- L2L – Liquid-to-Liquid (Cooling)
- L4S – Low Latency, Low Loss, Scalable Throughput
- LAN – Local Area Network
- LCA – Life Cycle Assessment
- LCC – Inductor-Capacitor-Capacitor (resonant converter)
- LDMOS – Laterally Diffused Metal Oxide Semiconductor
- LDO – Low Dropout (voltage regulator)
- LFM – Linear Feet per Minute (airflow)
- LGA – Land Grid Array
- LGV – Laser Guided Vehicle
- LISN – Line Impedance Stabilization Network
- LLC – Inductor-Inductor-Capacitor (resonant converter)
- LLM – Large Language Model
- LNA – Low Noise Amplifier
- LOD – Low Ohmic Distribution
- LPD – Lateral Power Delivery
- LPDDR – Low Power Double Data Rate
- LPF – Low Pass Filter
- LPWA – Low Power Wide Area
- LSB – Least Significant Bit
- LSTM – Long Short-Term Memory
- LT – Lead Time
- LTA – Long-Term Agreement
- LTB – Last Time Buy
- LTE – Long Term Evolution
- LTE-A – LTE Advanced
- LTE-M – LTE Machine (type communication)
- LTRR – Long Term Return Rate
- LTS – Last Time Ship
- LVD – Low Voltage Directive
- LVDC – Low Voltage Direct Current
M
- M2M – Machine to Machine
- MAC – Media Access Control (address)
- MBA – Multi Beam Antenna
- MBB – Mobile Broadband
- MBPA – Multi Beam Phased Array
- MCM – Multi-Chip Module
- MCRF – Mean Corrective Repair Frequency
- MCU – Microcontroller Unit
- MDF – Main Distribution Frame
- MEC – Mobile Edge Computing
- MEMS – Micro Electro-Mechanical Systems
- MFA – Multi-Factor Authentication
- MIMO – Multiple Input Multiple Output
- ML – Machine Learning
- MLB – Multi Layer Board
- MLCC – Multi Layer Ceramic Capacitor
- MLOps – Machine Learning Operations
- MLP – Multi-Layer Perceptron
- MMA – Modified Moving Average
- mMIMO – Massive Multiple Input Multiple Output
- mMTC – Massive Machine Type Communication
- mmW – Millimeter Wave
- MNO – Mobile Network Operator
- MOCN – Multi Operator Core Network
- MOE – Mixture Of Experts
- MOOP – Means Of Operator Protection
- MOP – Means of Protection
- MOPP – Means of Patient Protection
- MOQ – Minimum Order Quantity
- MORAN – Multi Operator Radio Access Network
- MOSFET – Metal Oxide Semiconductor Field Effect Transistor
- MOV – Metal Oxide Varistor
- MP – Mass Production
- MPA – Master Purchase Agreement
- MPC – Maximum Power Consumption
- MPN – Manufacturer Part Number
- MPPT – Maximum Power Point Tracking
- MPQ – Minimum Package Quantity
- MPU – Micro Processor Unit
- MR – Mixed Reality
- MRL – Manufacturing Readiness Level
- MRP – Materials Requirement Planning or Manufacturing Resource Planning
- MRR – Manufacturing Readiness Review
- MRT – Multi Resonant Topology
- MSA – Measurement System Analysis
- MSB – Most Significant Bit
- MSC – Mobile Switching Center
- MSDS – Material Safety Data Sheet
- MSL – Moisture Sensitivity Level
- MTA – Multi Tapped Autotransformer
- MTBF – Mean Time Between Failures
- MTTF – Mean Time To Failure
- MTTR – Mean Time To Repair
- MU-MIMO – Multi User MIMO
- MUX – Multiplexer
- MVDC – Medium Voltage Direct Current
- MVNO – Mobile Virtual Network Operator
N
- NACK – Negative Acknowledgement
- NAFTA – North American Free Trade Agreement
- NAPU – Network Addressable Processing Unit
- NAS – Network Attached Storage
- NAT – Network Address Translation
- NB-IoT – Narrow Band Internet of Things
- NCNR – Non-Cancellable Non-Returnable
- NDA – Non-Disclosure Agreement
- NDAA – National Defense Authorization Act
- NEBS – Network Equipment Building System
- NEDA – National Electronic Distributors Association
- NEMA – National Electrical Manufacturers Association
- NFF – No Fault Found
- NFV – Network Function Virtualization
- NGMN – Next Generation Mobile Networks (alliance)
- NIC – Network Interface Card
- NLP – Natural Language Processing
- NLR – Non-Linear Response
- NLU – Natural Language Understanding
- NOC – Network-on-Chip
- NPI – New Product Introduction
- NPR – New Product Requirement
- NPU – Neural/Network Processing Unit
- NQA – National Quality Assurance
- NR – New Radio (5G) or Notch Resonance
- NRE – Non-Recurring Engineering (charge)
- NRND – Not Recommended for New Designs
- NSA 5G – Non-Stand-Alone 5G
- NTC – Negative Temperature Coefficient
- NVM – Non-Volatile Memory
O
- O-RAN – Open Radio Access Network (Alliance)
- OADM – Optical Add/Drop Multiplexer
- OAI – Open Accelerator Infrastructure
- OAM – OCP Accelerator Module
- OBC – On Board Charger
- OCP – Over Current Protection or Open Compute Project
- OCPR – Over Current Protection Reset
- OCS – Optical Circuit Switch
- OCV – Open Circuit Voltage
- ODM – Original Design Manufacturer
- ODSC – Outdoor Small Cell
- ODU – OutDoor Unit or Open Distributed Unit
- OEE – Overall Equipment Effectiveness
- OEM – Original Equipment Manufacturer
- OES – Open Enterprise Server
- OFDM – Orthogonal Frequency Division Multiplexing
- OISA – Omni-Directional Intelligent Sensing
- OLT – Optical Line Termination
- ONT – Optical Network Terminal
- OPU – Omni Processing Unit
- ORT – Ongoing Reliability Testing
- ORU – Open Radio Unit
- ORv – Open Rack Version
- OT – Operational Technology
- OTFS – Orthogonal Time Frequency & Space
- OTP – Over Temperature Protection or One Time Programming
- OTT – Over The Top (streaming)
- OVP – Over Voltage Protection
- OXC – Optical Cross-Connect
P
- PA – Power Amplifier
- PAA – Phased Array Antenna
- PAE – Power Added Efficiency
- PAM – Power Amplifier Module
- PAPR – Peak to Average Power Ratio
- PBT – Persistent, Bioaccumulative, and Toxic (chemicals)
- PBX – Private Branch Exchange
- PCB – Printed Circuit Board
- PCBA – Printed Circuit Board Assembly
- PCI – Peripheral Component Interface
- PCIe – Peripheral Component Interface Express
- PCN – Product Change Notification
- PCR – Power Conversion Ratio
- PD – Powered Device
- PDB – Power Distribution Board
- PDCP – Packet Data Convergence Protocol
- PDE – Power Delivery Efficiency or Partial Differential Equation
- PDM – Pulse-Density Modulation
- PDN – Product Discontinuation Notice or Power Distribution/Delivery Network or Packet Data Network
- PDU – Power Distribution Unit
- PE – Polyethylene
- PEC – Packet Error Checking
- PER – Packet Error Rate
- PF – Power Factor
- PFC – Power Factor Correction
- PFM – Pulse Frequency Modulation
- PFMEA – Process Failure Mode and Effects Analysis
- PG – Power Good
- PHY – Physical Layer
- PICMG – PCI Industrial Computer Manufacturers Group
- PID – Proportional Integral Derivative or Packet Identifier
- PIM – Power Interface Module or Passive InterModulation
- PIP – Pin-In-Paste (for reflow soldering through hole parts)
- PIS – Product Information System
- PLC – Programmable Logic Controller or Product Life Cycle or Power Line Communications
- PLCM – Product Life Cycle Management
- PLL – Phase Locked Loop
- PMBus – Power Management Bus
- PMIC – Power Management Integrated Circuit
- PMU – Power Management Unit
- PN – Product Notification
- PO – Purchase Order
- PoE – Power Over Ethernet
- POEP – Power Over Ethernet Plus (PoE+)
- POFV – Plated Over Filled Via
- PoL – Point of Load (converter)
- POLA – Point Of Load Alliance
- PON – Passive Optical Network
- PoP – Package on Package
- PoP – Point of Presence
- POTS – Plain Old Telephone Service
- Pp – Process Performance Ratio
- PPAP – Production Part Approval Process
- PPB – Power Pulsation Buffering
- PPE – Polyphenylene Ether
- Ppk – Process Performance Index
- PPL – Peak Power Limiting or Preferred Parts List
- PPM – Parts Per Million
- PPPoE – Point-to-Point Protocol over Ethernet
- PR – Parallel Resonance
- PRC – Parallel Resonant Converter
- PRD – Product Requirement Document
- PROM – Programmable Read Only Memory
- PRR – Production Readiness Review
- PSA – Power Stamp Alliance
- PSE – Power Sourcing Equipment
- PSFB – Phase-Shifted Full-Bridge
- PSL – Preferred Suppliers List
- PSMP – Power Surface Multiplier Package
- PSRR – Power Supply Rejection Ratio
- PSU – Power Supply Unit
- PT – Potential Transformer
- PTC – Positive Temperature Coefficient or Powered Temperature Cycling
- PTH – Plated Through Hole
- PTMP – Point To Multi Point
- PTP – Point To Point or Power, Thermal, and Performance (sensors)
- PUE – Power Usage Effectiveness
- PV – Photovoltaic (inverter)
- PVT – Production Validation/Verification Testing
- PWB – Printed Wiring Board
- PWBA – Printed Wiring Board Assembly
- PWM – Pulse Width Modulation
Q
R
- RAG – Retrieval-Augmented Generation
- RAID – Redundant Array of Independent Disks
- RAM – Random Access Memory
- RAN – Radio Access Network
- RBS – Radio Base Station
- RC – Remote Control (on/off)
- RCI – Rack Cooling Index
- RDMA – Remote Direct Memory Access
- REACH – Registration, Evaluation, Authorization, and restriction of CHemicals
- REF – Renewable Energy Factor
- RET – Remote Electronic Tilt
- RF – Radio Frequency
- RFI – Radio Frequency Interference or Request For Information
- RFP – Request For Proposal
- RFPA – Radio Frequency Power Amplifier
- RFQ – Request For Quotation
- RGW – Radio Gateway
- RH – Relative Humidity
- RIC – RAN Intelligent Controller
- RISC-V – Reduced Instruction Set Computer (Version 5 architecture)
- RL – Reinforcement Learning
- RLC – Radio Link Control
- RLHF – Reinforcement Learning with Human Feedback
- RMA – Returned Material Authorization
- RMI – Responsible Minerals Initiative
- RMS – Root Mean Square
- RNC – Radio Network Controller
- RNN – Recurrent Neural Network
- ROADM – Reconfigurable Optical Add/Drop Multiplexer
- RoHS – Restriction of Hazardous Substances
- ROM – Read Only Memory or Rough Order of Magnitude
- RPA – Robotic Process Automation
- RPM – Revolutions Per Minute
- RPO – Recovery Point Objective
- RPU – Resistive Processing Unit
- RRC – Radio Resource Control
- RRH – Remote Radio Head
- RRU – Remote Radio Unit
- RS – Recommended Standard (e.g., RS232, RS485)
- RSM – Regional Sales Manager
- RTO – Recovery Time Objective
- RTU – Remote Terminal Unit
- RTY – Rolled Throughput Yield
- RU – Radio Unit or Rack Unit
- RX – Receive
S
- S2S – Service to Service
- SA – Serial Address or StandAlone
- SALERT – SMBus Alert
- SAML – Security Assertion Markup Language
- SAN – Storage Area Network
- SB – Sixteenth Brick
- SBC – Single Board Computer or Session Border Controller
- SBTi – Science Based Targets initiative
- SCADA – Supervisory Control And Data Acquisition
- SCAR – Supplier Corrective Action Request
- SCC – Switched Capacitance Converter or Short Circuit Current
- SCIP – Substances of Concern In articles as such or in complex objects (Products)
- SCL – Serial Clock Line
- SCP – Short Circuit Protection
- SCPD – Short Circuit Protective Device
- SCR – Silicon Controlled Rectifier
- SCSI – Small Computer System Interface
- SDA – Serial Data Line
- SDDC – Software Defined Data Center
- SDH – Synchronous Digital Hierarchy
- SDN – Software Defined Networking
- SDR – Single Data Rate
- SELV – Safety Extra Low Voltage
- SFOC – Sensorless Field Oriented Control
- SHSC – Symmetrical Hybrid Switched Capacitor
- SI – Système International
- SiC – Silicon Carbide
- SIM – Subscriber Identity Module
- SIMD – Single Instruction, Multiple Data
- SIMT – Single Instruction, Multiple Threads
- SIOP – Sales, Inventory, and Operations Planning
- SIP – Single Inline Package or System In Package or Session Initiation Protocol
- SKU – Stock Keeping Unit
- SLA – Service Level Agreement
- SLO – Service Level Objective
- SMA – Surface Mount Assembly
- SMBus – System Management Bus
- SMD – Surface Mount Device
- SME – Small and Medium Enterprise
- SMP – Surface Mount Package
- SMPS – Switched Mode Power Supply
- SMR – Small Modular Reactor
- SMT – Surface Mount Technology
- SNR – Signal-to-Noise Ratio
- SOA – Safe Operating Area
- SoC – System on Chip or Statement of Compliance
- SOIC – Small Outline Integrated Circuit
- SON – Self Organizing Network
- SONET – Synchronous Optical Networking
- SONiC – Software for Open Networking in the Cloud
- SPA – Specific Purchase Agreement
- SPC – Statistical Process Control
- SPI – Serial Peripheral Interface
- SPQ – Standard Package Quantity
- SPS – Standby Power Supply
- SPU – Security Processing Unit
- SQL – Structured Query Language
- SR – Series Resonance
- SRAM – Static Random Access Memory
- SRC – Series Resonant Converter
- SRF – Series Resonant Frequency
- SS – Safety Stock
- SSCB – Solid State Circuit Breaker
- SSCM – Strategic Supply Chain Management
- SSD – Solid State Drive
- SSO – Single Sign-On
- SST – Solid State Transformer
- STC – Switched Tank Capacitor
- STEP – Standard for the Exchange of Product model data
- SUE – Scale-Up Ethernet
- SVHC – Substances of Very High Concern
- SVID – Serial Voltage Identifier
- SW – Software
- SWaP-C – Size, Weight, Power, and Cost
- SWG – Standard Wire Gauge
T
- T&R – Tape and Reel
- TAA – Trade Agreements Act
- TC – Temperature Cycling
- TCE – Thermal Coefficient of Expansion
- TCO – Total Cost of Ownership
- TCP – Transport Control Protocol
- TCS – Technology Cooling System
- TD-SCDMA – Time Division-Synchronous Code Division Multiple Access
- TDC – Thermal Design Current
- TDD – Time Division Duplex
- TDM – Time Division Multiplex
- TDMA – Time Division Multiple Access
- TDP – Thermal Design Power
- TFR – Test For Reliability
- TH – Through Hole
- THB – Temperature Humidity Bias
- THD – Total Harmonic Distortion
- THT – Through Hole Technology
- TIA – Telecommunications Industries Association
- TIM – Thermal Interface Material
- TIP – Telecom Infra Project
- TLVR – Trans-Inductor Voltage Regulator
- TMA – Tower Mounted Amplifier
- TOBA – Telecom On-Board Architecture
- TOR – Top Of Rack
- TPL – Top of rack Power Loss
- TPP – Total Processor Performance
- TPU – Tensor Processing Unit
- TR – Technical Report
- TRL – Technology Readiness Level
- TRU – Transmitter Receiver Unit
- TSCA – Toxic Substances Control Act
- TSN – Time Sensitive Networking
- TSV – Through-Silicon Via
- TTL – Transistor Transistor Logic
- TUV – Technischer Überwachungs Verein
- TVS – Transient Voltage Suppressor
- TVSS – Transient Volt Surge Suppression
- TX – Transmit
U
- UART – Universal Asynchronous Receiver/Transmitter
- UBB – Universal BaseBoard
- UCIe – Universal Chiplet Interconnect Express
- UCP – Under Current Protection
- UEC – Ultra Ethernet Consortium
- UI – User Interface
- UKCA – UK Conformity Assessed
- UL – Underwriters Laboratories
- UL-MIMO – Ultra-Large-Scale MIMO
- UMTS – Universal Mobile Telecommunications System
- UPOE – Universal Power Over Ethernet (PoE++)
- UPS – Uninterruptable Power Supply
- uRLLC – Ultra Reliable Low Latency Communication
- USB – Universal Serial Bus
- UUT – Unit Under Test
- UVLO – Under Voltage Lock Out
- UVP – Under Voltage Protection
- UX – User eXperience
V
- V-RAN – Virtualized Radio Access Network
- VA – Virtual Assistant
- vBBU – Virtual Baseband Unit
- VCO – Voltage Controlled Oscillator
- VCU – Video Coding Unit
- VDC – Virtual Data Center or Volt Direct Current
- VDE – Verband Deutscher Elektrotechniker
- VDI – Virtual Desktop Infrastructure
- VFD – Variable Frequency Drive
- VFF – Voltage Feed Forward
- VGA – Variable Gain Amplifier
- VID – Voltage Identifier
- VIPPO – Via in Pad Plated Over
- VLAN – Virtual Local Area Network
- VM – Virtual Machine
- VMC – Voltage Mode Control
- VNF – Virtual Network Function
- VoC – Verification of Conformity
- VoIP – Voice over IP (Internet Protocol)
- VoLTE – Voice over LTE
- VoNR – Voice over New Radio
- VPD – Vertical Power Delivery
- VPN – Virtual Private Network
- VPU – Vision Processing Unit
- VPWR – Vertical Power
- VQFN – Very thin Quad Flat No-lead
- VR – Virtual Reality
- VRM – Voltage Regulator Module
- VSD – Variable Speed Drive
W
- WAN – Wide Area Network
- WAP – Wireless Access Protocol
- WBG – Wide Band Gap (semiconductor)
- WCA – Working Capital Agreement
- WCDMA – Wideband Code Division Multiple Access
- WEEE – Waste Electrical and Electronic Equipment (directive)
- WFD – Waste Framework Directive
- WFE – Wafer Fabrication Equipment
- WiMAX – Worldwide Interoperability for Microwave Access
- WIP – Work In Progress
- WISP – Wireless Internet Service Provider
- WLAN – Wireless Local Area Network
- WSE – Wafer-Scale Engine
- WUE – Water Usage Effectiveness