We announce the launch of the BMR323 — a new generation of non-isolated, unregulated Intermediate Bus Converters (IBCs) designed to meet the growing low-voltage, high-power demands of AI and cloud computing applications.
Delivering up to 1.2 kW peak power with a peak efficiency of 97.8%, the BMR323 achieves over 60% more power than its predecessor, the BMR320, while maintaining footprint compatibility. This allows existing designs to be easily upgraded, providing a way to meet rising continuous and peak power requirements with minimal redesign.
Engineered for high power density and cost-effective implementation, the BMR323 provides 600 W continuous output power. Up to six units can be paralleled for a total output of up to 3.6 kW, with active current sharing ensuring efficient load distribution and system stability.
“The BMR323 combines outstanding efficiency with high peak power capability up to 7.2 kW with 6 units in parallel and the low output voltage enables high 2nd step converter efficiency. Backed by Flex Power Modules’ proven high standards for testing and qualification, it offers a reliable, high-performance solution for next-generation data center designs,” said Olle Hellgren, director, product management and marketing, Flex Power Modules.
The module operates from a 40–60 V input and delivers an unregulated 5–7.5 V output, housed in a compact 1.06 × 0.71 × 0.26 inch (27.0 × 18.0 × 6.7 mm) package, making it ideal for space-constrained designs.
Die BMR323 is compatible with Flex Power Designer, a software tool providing configuration, performance simulation, and monitoring features via a PMBus® interface. The software is downloadable for free at www.flexpowerdesigner.com.
A high-efficiency hybrid switching capacitor (HSC) topology combined with an open-frame design improves thermal performance, enabling better cooling and higher output power. The module is optimized for operation with a heatsink mounted on top of the device, but there is flexibility for other cooling methods to be used with the solution, such as direct-to-chip liquid cooling.
Die BMR323 also meets the latest IEC/EN/UL 62368-1 safety standards and is fully compatible with Pb-free SMD reflow processes for lead-free manufacturing and high-temperature soldering profiles.