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Solving power, heat, and scale challenges with integrated data center solutions

Michael Hartung, presidente, soluciones de agilidad, Flex
por Michael Hartung
Presidente, Director Comercial
Publicado en
octubre 13, 2025

Addressing today’s biggest challenges: power, heat, and scale

Hyperscalers and colocation providers make calculated decisions about where to site facilities to access power, meet fiscal and operational targets, and best serve their customers. Data center hubs are expanding in all regions, including novel locations north of the Arctic circle and under the sea. Wherever they choose to build, Flex has made it our mission to help them solve their toughest challenges — power, heat, and scale:

The biggest challenge today is that data center operators need access to more power sources. This starts at the facility level, with delivery of power from the grid. Once secured, they must be able to distribute that power efficiently through the facility and rack, and ultimately to the chip.

As power consumption increases, so does the heat. As the industry pushes toward 1 megawatt racks, data center operators face the urgent challenge of developing new cooling strategies.

Hyperscalers and colocation providers are racing to scale infrastructure at unprecedented speed to support explosive AI demand. And the challenge isn’t just speed, but doing so with resilience to ensure deployments keep pace without disruption.

Becoming the partner of choice for data center infrastructure solutions

At Flex, we know that navigating inflection points is no small task, especially in an industry that is tripling in capacity by 2030. Our data center customers need vertically integrated solutions that are tailored to their specifications and timelines, tested for optimal performance from the moment they’re installed. By collaborating with chipmakers and hyperscalers years ahead of new paradigms, we evolve our solutions in step with industry innovation and our customers’ roadmaps. This strategy keeps customer success at the center while expanding Flex’s portfolio to address the industry’s most pressing needs. Highlights from the past year include:

Flex significantly expanded manufacturing capacity for critical power in the U.S. and Europe, including a new facility in Dallas, Texas, expanded capacity at our Columbia, South Carolina site, and a new facility in Bielsko-Biała, Poland. We also strengthened our critical power portfolio with the acquisition of Crown Technical Systems, a leader in high-performance power distribution and protection.

Collaborations with innovators, including Nvidia, Musashi Energy Solutions, y Renesas, served as the foundation for the development of unique products that enable our customers to improve power efficiency for AI workloads. 

Nuestra acquisition of JetCool, a leader in advanced liquid cooling technologies for high density compute, expanded Flex’s portfolio with solutions that enable customers to stabilize thermal loads, increase cooling efficiency, and support scalable performance in the rack.

Flex has long served as a manufacturer of choice for sophisticated IT equipment, a discipline we apply to our proprietary data center products and from-the-ground-up rack and enclosure builds. Since fiscal year 2024, we have strategically expanded our global manufacturing footprint by over 8 million square feet to enable customers to deliver products at scale in every major geography. 

Flex has continued strengthening our global services that span the entire AI infrastructure lifecycle, from design and sourcing to deployment, cumplimiento, y soluciones de economía circular. This approach enables customers to gain not only integrated hardware, but also services that enhance reliability, advance sustainability, and drive scale.

Case in point: The first fully integrated, globally manufactured AI infrastructure platform

Our strategy is reflected in the new AI infrastructure platform Flex introduced at OCP Global Summit this week. An industry first, it integrates power, cooling, compute, and services into modular designs that reduce execution risk, speed deployment up to 30 percent, and scale reliably to meet the pace of demand. Its flexible, open architecture is partner-friendly and easily adapts to products from customer-preferred original equipment manufacturers (OEMs).

The platform comprises new products from across our portfolio, including:

  • 1MW racks — High-density, liquid-cooled IT rack and OCP-inspired power rack designed to support +/-400V and enable the transition to 800 VDC architecture announced by NVIDIA for next-generation AI infrastructure
Close up of a data center rack enclosure
  • Sistema de almacenamiento de energía capacitivo (CESS) — A first-to-market, UL 1973–certified CESS that reduces electrical disturbances from AI workloads
  • Modular rack-level coolant distribution unit (CDU) — A scalable CDU delivering up to 1.8 MW of flexible capacity to support evolving AI, HPC, and hyperscale workloads, backed by comprehensive global support and warranty coverage
  • Prefabricated power pods and skids — Pre-engineered modular systems that simplify installation, cut onsite labor costs, and shorten deployment time to just six to 12 months

In an industry where time to production defines success, choosing the right partner is critical. Customers increasingly see the strategic value in working with an end-to-end provider who can accelerate deployment and reduce risk by managing the entire stack, from design and manufacturing through commissioning. With our innovative product portfolio and operational agility, Flex helps data center operators meet the challenges of power, heat, and scale head-on, enabling them to scale faster in a rapidly evolving AI era.