The Flex Power Modules booth saw a flurry of participation at the recent Open Compute Project (OCP) Global Summit 2019.
Our portfolio of solutions attracted considerable customer interest – especially those solutions relevant to data center and cloud computing infrastructure.
At the forefront of 48V to load direct conversion
We presented new insights into ‘48V to Load Direct Conversion,’ aimed at eliminating a power conversion stage. These technology solutions convert 48V directly to silicon core voltages suitable for today’s processors, which are typically as low as 0.5 VDC.
The first generation BMR481 isolated converter, released at the end of 2018, impressed with its efficiency and reduced board area. At the show, we provided an exciting sneak preview of the second generation of our direct conversion modules. The BMR482 with 1.0V/100A output delivers significant efficiency and power density to power designers.
Powering up with new technologies
We also presented new high-power DC-DC modules like the BMR490 1300W quarter-brick, delivering a market leading power density of 684W/in3 at a >97% efficiency.
We also shared our switched capacitor intermediate bus converter, which targets ultra-high efficiencies around 98% and delivers a peak power level of up to 900W.
Additionally, excitement surrounded the vertically-mounted units that will be launched soon. The power surface multiplier package (PSMP) concept is also generating interest because it occupies less board space and is a useful solution for distributing power in smaller chunks.
The OCP Summit provided a powerful platform for our Power Modules business – and a spotlight for our new technologies.