Flextronics advanced manufacturing for next-gen PCBA
Advanced printed circuit board assemblies (PCBAs) increasingly have to perform more functions - at a smaller size and weight. To meet your quality, performance and speed targets, it’s critical to deploy the right advanced manufacturing and engineering technologies at the right stages.
Using our Flextronics advanced testing, simulation and miniaturization capabilities paired with Design for Excellence (DFX) services, we can help you determine key design improvements to optimize manufacturing before you ever begin production. And from flip chip to passive component, low voiding soldering, underfill and signal integrity, apply the latest technologies and techniques for flawless assembly and maximum performance.
From flip chip to the smallest passive and oddly-shaped components, high density assembly, low voiding soldering, proper underfill, edge bonding - including PCB protection with nano coating and conformal coating - and understanding materials impact on signal integrity, we can help you apply the latest technologies and techniques for flawless assembly and maximum performance.
Finite element modeling
Make sure PCBA manufacturing goes off without a hitch by first modeling systems in a virtual environment using finite element modeling. We can analyze stresses and strains on the PCBA and simulate assembly process impact on solder joints, while conducting thermal analysis, to ensure that our assembly techniques and processes deliver the highest yield at the highest quality.
Virtual simulation failure analysis
Even without a physical product, we can conduct thorough testing to assess the preparedness of your design. We’ll test your product virtually using pertinent data, then provide design feedback for increased reliability and efficient manufacturing. Once a product is manufactured, we can use signal and power integrity simulations to assist failure analysis and debug on those assemblies.
Assemble for the long haul
When it comes time to assemble, lead with industry-leading capabilities - from large complex boards to 3D assembly and beyond. Our knowledge of, and experience with, system-in-package (SiP) means you get multiple electronic components in one integrated part to advance your miniaturization goals. And thanks to environmental technologies and additive processes, your electronic components can be more eco-friendly and support your circular economy efforts.
Over 50-years’ experience
We have extensive experience assembling Large Form Factor boards up to sizes not typical of the standard assembly process, including large 91x91mm BGAs and 98x98mm CPU sockets. Our Flextronics proprietary assembly process methodology helps prevent negative impacts, such as HIP/NWO, resulting in faster new product introduction and a reliable manufacturing process.