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# Flex: Design, Manufacturing, and Supply Chain Logistics

## Sitemaps
[XML Sitemap](https://flex.com/sitemap_index.xml): Includes all crawlable and indexable pages.

## Pages
- [e2open Training Materials](https://flex.com/solutions-and-services/supply-chain/supplier-information/e2open-training-materials): Flex is transitioning from the Flex Supplier Portal (FSP) and Email PO (ePO) to e2open to support supplier collaboration across purchase orders, shipments (ASN), and forecast processes.
- [Transaction Resources](https://flex.com/transaction-resources): On May 5, 2026, Flex announced that its Board of Directors has unanimously approved moving forward with a plan to spin off its Cloud and Power Infrastructure segment, creating two independent, publicly traded companies, each optimally positioned to serve their customers and create value for their shareholders.
- [Product Discontinuation Notices](https://flex.com/products/power-modules/product-discontinuation-notices): PUx and PNB-A — 06/26/2026
- [Apprenticeships at Flex in Hägglingen, Switzerland](https://flex.com/careers/switzerland/apprenticeships): At Flex, we offer our customers a comprehensive range of services across our two Swiss locations in Hägglingen and Küssnacht, covering innovation, design, engineering, manufacturing, and supply chain solutions for precision plastics production. Become part of our successful team and start your apprenticeship at Flex in Hägglingen.
- [Contact Public Relations](https://flex.com/newsroom/contact-public-relations): Contact Flex Public Relations
- [Technical Abbreviations](https://flex.com/products/power-modules/technical-abbreviations): This glossary provides definitions for key terms used in power electronics, DC/DC conversion, data center power architectures, AI compute systems, and digital power management. It supports engineers, system architects, and developers working with advanced power delivery solutions, including 48 VDC and 800 VDC architectures, OCP standards, and high-efficiency board solutions.
- [Next-gen 800 VDC architecture modules](https://flex.com/products/power-modules/800-vdc-modules): As AI, ML, and hyperscale compute workloads surge toward megawatt‑class rack power, the global data center ecosystem is undergoing its most significant architecture shift in a decade. Flex Power Modules delivers advanced in-rack power conversion and distribution solutions for both NVIDIA’s 800 VDC architecture and the Open Compute Project’s (OCP) ±400 VDC “Diablo 400” standard — the two frameworks enabling the future of efficient, scalable, and sustainable AI infrastructure.
- [Download Flex Power designer](https://flex.com/products/power-modules/flex-power-designer/download-software): Download Flex Power Designer To download our free software, please submit the details requested below:
- [Flex Automotive — EMC Laboratory Stuttgart ISO 17025:2018 accredited](https://flex.com/industries/automotive/flex-automotive-emc-laboratory-stuttgart-iso-170252018-accredited): The EMC Lab in Frickenhausen is part of Flex Automotive organization in Germany, dedicated to testing automotive products and is accredited according to the international ISO 17025:2018 Standard. The accreditation is provided by DAkkS and proves that the laboratory uses official and standardized test methods, regularly calibrated equipment, and provides reproducible and independent test results.
- [FAQs](https://flex.com/products/power-modules/faqs): Find answers to the most frequently asked questions from our world-wide customers and partners
- [Thermal management and cooling techniques](https://flex.com/products/power-modules/thermal-management-and-cooling-techniques): Thermal design for DC/DC converters is a critical aspect of ensuring the reliability and longevity of power electronics systems. DC/DC converters generate heat due to switching and conduction power losses in the components (such as semiconductors, inductors, and capacitors) during the power conversion process.
- [Vertical Power Delivery](https://flex.com/products/power-modules/vertical-power-delivery): Power hungry applications such as Artificial Intelligence (AI) and Machine Learning (ML) which utilize the latest ASICs or xPUs (TPU/GPU/CPU/NPU/IPU) require vast amounts of current to be delivered to the core at sub 1 V levels, and need to deal with ultra fast load transient demands with the least amount of disturbance to the critical voltages used to feed them.
- [Power Modules Contact Us](https://flex.com/products/power-modules/contact-us): Contact Flex Power Modules Use the form below to send general or technical inquiries to our support team.
- [Flex Power Designer](https://flex.com/products/power-modules/flex-power-designer): The Flex Power Designer software goes beyond converter configuration and provides an overview of the whole power system enabling you to define relationships across rails, including phase spreading, sequencing, and fault spreading, using the standard PMBus protocol.
- [Power Modules](https://flex.com/products/power-modules): Flex Power Modules is a global leader in advanced power conversion solutions. For over 45 years, we’ve delivered high-efficiency DC/DC converters that enable the performance and reliability demanded by today’s most critical applications—data centers, cloud computing, AI, telecom, industrial automation, and railway systems.
- [Product Selector](https://flex.com/products/power-modules/product-selector)
- [Accessibility](https://flex.com/accessibility): Flex.com is designed and developed to be accessible to the widest possible audience, including people with disabilities, and to be compatible with commonly used assistive technologies and accessibility features provided by major operating systems and web browsers.
- [Komplex kutatás-fejlesztési program megvalósítása a Flextronics International Kft. zalaegerszegi telephelyén](https://flex.com/careers/hungary/komplex-kutatas-fejlesztesi-program-megvalositasa-a-flextronics-international-kft-zalaegerszegi-telephelyen): A kedvezményezett neve: Flextronics International Termelő és Szolgáltató Vámszabadterületi Kft.
- [Social @ Flex](https://flex.com/social-flex): Social @ Flex
- [Awards](https://flex.com/company/awards): Flex Awards
- [Flex Automotive Product Security Incident Response Management (PSIRM)](https://flex.com/flex-automotive-product-security-incident-response-management-psirm): At Flex, we prioritize the security, safety, and reliability of our products above all.
- [Power and Cooling](https://flex.com/products/power-and-cooling): Our products and services from Anord Mardix, Crown Technical Systems, and Electrical Power Products (EP²) deliver safe, reliable, and high-quality critical power solutions. We deliver innovative solutions, effortlessly meeting even the most complex technical requirements.
- [Products](https://flex.com/products): Products
- [A Magyar Nemzeti Kutatási, Fejlesztési és Innovációs Alap által támogatott K+F](https://flex.com/careers/hungary-en/a-magyar-nemzeti-kutatasi-fejlesztesi-es-innovacios-alap-altal-tamogatott-kf): A Pannon Egyetem együttműködött a Flex vállalatával egy kormányzati támogatású, kutatási projektben azzal a céllal, hogy javítsák a forrasztási technológia hatékonyságát és megbízhatóságát, különösen az autóiparban alkalmazott, teljesítmény szempontjából kritikus elektronikai szerelvényeknél. A „Folyasztószer-minimalizált forrasztás nagyfeszültségű autóipari termékekhez” című projektet közösen finanszírozta a Flex Kft, a Pannon Egyetem és az Innovációs és Technológiai Minisztérium (ITM), amelynek összköltsége 1.339.723.068 Ft. Sikerült egy olyan új típusú,
- [Circale](https://flex.com/solutions-and-services/aftermarket-services/circale): Through hosted technology and industry expertise, Circale quantifies the impact of circular processes across returns, repair, refurb, resale, and recycling efforts spanning different vendors in various locations.
- [FreeFlow](https://flex.com/solutions-and-services/aftermarket-services/freeflow): As a business-to-business marketplace for inventory management, FreeFlow helps you efficiently streamline your remarketing efforts and profit from your retail, returned, obsolete, or excess stock. We designed FreeFlow to deliver real return on inventory and provide a scalable solution with the rigorous controls and transparency that our customers expect.
- [Water management practices](https://flex.com/company/sustainability/reports-and-disclosures/water-management-practices): On December 19, 2024, Flex Zhuhai B11 received the Alliance for Water Stewardship (AWS) Core Level certification, marking a significant advancement in sustainable water management.

## Downloads
- [Product Discontinuation Notice – PKR2221A variants 06/25/2026](https://flex.com/downloads/product-discontinuation-notice-pkr2221a-variants-06-25-2026)
- [Product Discontinuation Notice – PUx_PNB-A modules 06/26/2026](https://flex.com/downloads/product-discontinuation-notice-pux_pnb-a-modules-06-26-2026)
- [Product Discontinuation Notice – BMR480 06/25/2026](https://flex.com/downloads/product-discontinuation-notice-bmr480-06-25-2026)
- [E2open 供应协作 用户指南 针对供应商角色 – 标准用户界面](https://flex.com/downloads/e2open-%e4%be%9b%e5%ba%94%e5%8d%8f%e4%bd%9c-%e7%94%a8%e6%88%b7%e6%8c%87%e5%8d%97-%e9%92%88%e5%af%b9%e4%be%9b%e5%ba%94%e5%95%86%e8%a7%92%e8%89%b2-%e6%a0%87%e5%87%86%e7%94%a8%e6%88%b7%e7%95%8c)
- [E2open 供应协作 用户指南 针对供应商角色 – 长尾合作伙伴](https://flex.com/downloads/e2open-%e4%be%9b%e5%ba%94%e5%8d%8f%e4%bd%9c-%e7%94%a8%e6%88%b7%e6%8c%87%e5%8d%97-%e9%92%88%e5%af%b9%e4%be%9b%e5%ba%94%e5%95%86%e8%a7%92%e8%89%b2-%e9%95%bf%e5%b0%be%e5%90%88%e4%bd%9c%e4%bc%99)
- [2025 CDP Climate Change and Water Security Questionnaire](https://flex.com/downloads/2025-cdp-climate-change-and-water-security-questionnaire)
- [Beyond PUE Infographic: Data center efficiency in the AI era](https://flex.com/downloads/beyond-pue-infographic-data-center-efficiency-in-the-ai-era)
- [Case Study: Flex pilots Catena-X-based data exchange for global automakers](https://flex.com/downloads/case-study-flex-pilots-catena-x-based-data-exchange-for-global-automakers)
- [Power shelf for NVIDIA Vera Rubin NVL72 Datasheet](https://flex.com/downloads/power-shelf-for-nvidia-vera-rubin-nvl72-datasheet)
- [用户界面概述](https://flex.com/downloads/%e7%94%a8%e6%88%b7%e7%95%8c%e9%9d%a2%e6%a6%82%e8%bf%b0)
- [User interface overview](https://flex.com/downloads/user-interface-overview)
- [User interface user guide](https://flex.com/downloads/user-interface-user-guide)
- [发货（ASN）与预测概述](https://flex.com/downloads/%e5%8f%91%e8%b4%a7%ef%bc%88asn%ef%bc%89%e4%b8%8e%e9%a2%84%e6%b5%8b%e6%a6%82%e8%bf%b0)
- [ASN and forecast overview](https://flex.com/downloads/asn-and-forecast-overview)
- [采购订单用户指南](https://flex.com/downloads/%e9%87%87%e8%b4%ad%e8%ae%a2%e5%8d%95%e7%94%a8%e6%88%b7%e6%8c%87%e5%8d%97)
- [PO user guide overview](https://flex.com/downloads/po-user-guide-overview)
- [Supplier role long tail user guide](https://flex.com/downloads/supplier-role-long-tail-user-guide)
- [BMR684 (36-75Vin; 50Vout; 16A/800W)](https://flex.com/downloads/bmr684-36-75vin-50vout-16a-800w)
- [Simplified STEP File – BMR6841120/201 (typ)](https://flex.com/downloads/simplified-step-file-bmr6841120-201-typ)
- [800 VDC Power Rack Solution Brief](https://flex.com/downloads/800-vdc-power-rack-solution-brief)
- [Product Discontinuation Notice – PKV Series 05/14/26](https://flex.com/downloads/product-discontinuation-notice-pkv-series-05-14-26)
- [Infographic: Prefabricated modular data center solutions](https://flex.com/downloads/infographic-prefabricated-modular-data-center-solutions)
- [Cloud and Power Infrastructure spin-off (Simplified Chinese)](https://flex.com/downloads/cloud-and-power-infrastructure-spin-off-simplified-chinese)
- [Cloud and Power Infrastructure spin-off (Spanish)](https://flex.com/downloads/cloud-and-power-infrastructure-spin-off-spanish)
- [Cloud and Power Infrastructure spin-off (English)](https://flex.com/downloads/cloud-and-power-infrastructure-spin-off-english)
- [Warehousing solution brief](https://flex.com/downloads/warehousing-solution-brief)
- [Flex Power Modules General Terms and Conditions of Sale](https://flex.com/downloads/flex-power-modules-general-terms-and-conditions-of-sale)

## News

## Resources
- [Product discontinuation notices](https://flex.com/resources/product-discontinuation-notices)
- [Flex CEO Discusses the Future on The Claman Countdown — Fox Business](https://flex.com/resources/flex-ceo-discusses-the-future-on-the-claman-countdown-fox-business): Revathi Advaithi on the spin-off, sharper focus, and forces transforming power and manufacturing.
- [The scaling problem behind the AI data center boom](https://flex.com/resources/the-scaling-problem-behind-the-ai-data-center-boom): As data center operators race to build out AI infrastructure, they face numerous hurdles. Some are well-documented, including power availability, sustainability pressures, and supply chain disruptions. Others receive less attention but can significantly impact roadmaps, costs, and timelines. Scale and complexity lie behind some of the biggest challenges engineers and operators must solve for today.
- [BMR684: 800 W quarter-brick DC/DC converter for telecom RFPA and datacom applications](https://flex.com/resources/bmr684-800-w-quarter-brick-dc-dc-converter-for-telecom-rfpa-and-datacom-applications): This new variant of the BMR684 is an 800 W quarter-brick isolated DC/DC converter designed for telecom RFPA applications.
- [Modular approach cuts data center build time by 30%](https://flex.com/resources/modular-approach-cuts-data-center-build-time-by-30): Flex modular systems advance scalable data centers by streamlining construction and adapting to compute needs.
- [Addressing power constraints in AI data centers](https://flex.com/resources/addressing-power-constraints-in-ai-data-centers): Flex helps data center operators navigate growing power challenges through integrated, scalable strategies.
- [Flex CEO discusses the new industrial era on Washington Post Live](https://flex.com/resources/flex-ceo-discusses-the-new-industrial-era-on-washington-post-live): CEO Revathi Advaithi joins Washington Post Live on the forces shaping the next era of manufacturing.
- [The hidden risks jeopardizing rapid AI data center expansion](https://flex.com/resources/the-hidden-risks-jeopardizing-rapid-ai-data-center-expansion): If you could use just one word to encapsulate the challenges data center operators must solve as the AI era takes off, what would it be?
- [Flex to join S&P 500](https://flex.com/resources/flex-to-join-sp-500): The inclusion takes effect June 22, 2026, reflecting the company's transformation and consistent performance.
- [Flex pilots Catena-X-based data exchange for global automakers](https://flex.com/resources/flex-pilots-catena-x-based-data-exchange-for-global-automakers): As an early member of the Catena-X ecosystem, Flex is dedicated to advancing standards-based data exchange technology.
- [Beyond PUE: Multidimensional framework for data center efficiency in the AI era](https://flex.com/resources/beyond-pue-multidimensional-framework-for-data-center-efficiency-in-the-ai-era): PUE and complementary metrics form a multidimensional framework for data centers to evaluate efficiency.
- [The race to rethink data centers for AI’s power surge](https://flex.com/resources/the-race-to-rethink-data-centers-for-ais-power-surge): Featured in Bloomberg: How Flex is advancing the infrastructure powering AI at scale.
- [Rethinking water use in data center cooling systems for the AI era](https://flex.com/resources/rethinking-water-use-in-data-center-cooling-systems-for-the-ai-era): AI changes everything about thermal design. We’re moving from relatively predictable, CPU-based workloads to GPU-driven environments with extreme power densities and highly dynamic load profiles. That means heat is more concentrated, more variable, and much harder to manage with traditional, air-based systems. Cooling is no longer just about maintaining ambient temperature; it’s about removing heat precisely at the source — at the chip level — in real time. That’s where direct-to-chip liquid cooling becomes essential, not optional.
- [BMR317: A next-generation IBC designed for peak AI loads in an optimized footprint](https://flex.com/resources/bmr317-a-next-generation-ibc-designed-for-peak-ai-loads-in-an-optimized-footprint): The BMR317 is a third-generation, compact 8:1 fixed ratio IBC engineered for next-generation AI systems.
- [Power shelf for NVIDIA Vera Rubin NVL72](https://flex.com/resources/power-shelf-for-nvidia-vera-rubin-nvl72): Flex's 110 kW 3RU MGX power shelf for NVIDIA Vera Rubin NVL72 (or equivalent) is designed for the most demanding GPU workloads.
- [800 VDC power rack](https://flex.com/resources/800-vdc-power-rack): Accelerate deployment in next-generation AI data centers with the 800 VDC power rack.
- [Megawatt racks are coming: How 800 VDC architectures reduce losses and remove constraints](https://flex.com/resources/megawatt-racks-are-coming-how-800-vdc-architectures-reduce-losses-and-remove-constraints): Discover how 800 VDC architecture powers megawatt racks, minimizes inefficiencies, and removes scaling constraints.
- [From Mexico, we are powering the Data Center world](https://flex.com/resources/from-mexico-we-are-powering-the-data-center-world): Building data centers requires a lot of power, technology, and equipment. In Mexico, our teams build racks and enclosures for critical power technology, designed to protect, integrate, and scale technology that powers the AI transformation.
- [Speed to token: Why AI infrastructure demands a new deployment model](https://flex.com/resources/speed-to-token-why-ai-infrastructure-demands-a-new-deployment-model): Speed to token is the new benchmark for AI success. Explore how prefabricated modular data centers enable faster, scalable, and more reliable infrastructure deployment.
- [JetCool Expands SmartPlate™ System Portfolio with Closed-Loop Cooling for Next-Generation Compute](https://flex.com/resources/jetcool-expands-smartplate-system-portfolio-with-closed-loop-cooling-for-next-generation-compute): JetCool, a Flex (NASDAQ: FLEX) company and leading provider of advanced cooling for AI and high-density computing, today announced the launch of its SmartPlate™ System for Dell PowerEdge R770 and R7725 servers. Designed to help enterprises and edge operators achieve more compute density per rack, the direct-to-chip solution supports next-generation platforms powered by 5th Gen AMD® EPYC™ and Intel® Xeon 6 processors.
- [Quarter-brick DC/DC converter evolution: Advancing power density and efficiency](https://flex.com/resources/quarter-brick-dc-dc-converter-evolution-advancing-power-density-and-efficiency): The quarter-brick DC/DC converter evolution is no longer simply about achieving higher power density. Today’s power design engineers are being asked to reach further and need the right tools for the job.
- [Bloomberg Open Interest: Flex CEO Bets Big On AI](https://flex.com/resources/bloomberg-open-interest-flex-ceo-bets-big-on-ai): Flex CEO Revathi Advaithi shares her excitement about leading Flex’s intended AI infrastructure spin-off.
- [Infographic: Prefabricated modular data center solutions](https://flex.com/resources/infographic-prefabricated-modular-data-center-solutions): A side-by-side comparison of schedule, onsite labor, supply chains, and safety for prefabricated modular data center solutions.
- [Flex CEO joins Bloomberg Businessweek Daily](https://flex.com/resources/flex-ceo-joins-bloomberg-businessweek-daily): CEO Revathi Advaithi discusses Flex’s intent to spin off and the company’s Q4 and FY26 earnings results.
- [Powering data centers from grid to chip](https://flex.com/resources/powering-data-centers-from-grid-to-chip): Discover how Flex addresses data center infrastructure requirements to support accelerated customer expansion.
- [Flex CEO breaks down spin‑off on CNBC Squawk Box](https://flex.com/resources/flex-ceo-breaks-down-spin-off-on-cnbc-squawk-box): CEO Revathi Advaithi outlines Flex’s intent to spin off its Cloud and Power Infrastructure segment.
- [Beyond PUE: Rethinking data center efficiency in the AI era](https://flex.com/resources/beyond-pue-rethinking-data-center-efficiency-in-the-ai-era): Today’s data centers are complex and interconnected, where improvements in one area can impact efficiency in another. With this, PUE can be directionally useful, but can also be misleading.
- [Beyond PUE: Data center efficiency in the AI era](https://flex.com/resources/beyond-pue-data-center-efficiency-in-the-ai-era): Explore AI data center efficiency beyond PUE where metrics like WUE, CUE, ERE & CPE help create a smarter framework.
- [Introduction to the Flex Power Modules product selector](https://flex.com/resources/introduction-to-the-flex-power-modules-product-selector): The Flex Power Modules product selector lets you quickly identify the right DC/DC power module based on your system requirements. This overview will walk you through how to navigate the updated parametric search tool to filter through Flex power modules by electrical, mechanical, and application-specific requirements.
- [Warehousing ](https://flex.com/resources/warehousing): Flex's global warehousing services help OEMs adapt to demand, reduce holding costs, and integrate seamlessly into forward and reverse flows.
- [Navigating a turning point in sustainable manufacturing](https://flex.com/resources/navigating-a-turning-point-in-sustainable-manufacturing): Explore how sustainable manufacturing is evolving and how to navigate changes through transparency, partnerships, and global manufacturing operations.
- [Thermal model BMR316](https://flex.com/resources/thermal-model-bmr316)
- [Spare parts logistics: Right parts, right place, right time](https://flex.com/resources/spare-parts-logistics): A missing part can halt production, delay service, and impact revenue. As companies scale globally, the complexity of managing spare parts logistics grows exponentially. As part of Flex’s integrated services portfolio, spare parts logistics connects delivery, service, and return activities across the product lifecycle.
- [Beyond returns: Why reverse logistics is a growth strategy, not a cost center](https://flex.com/resources/beyond-returns-why-reverse-logistics-is-a-growth-strategy-not-a-cost-center): As supply chains grow more complex and margins tighten, forward-thinking OEMs are looking beyond traditional growth levers. And while product innovation and geographic expansion remain critical, a quieter opportunity is gaining strategic importance: value recovery across the product lifecycle.
- [Vendor-managed inventory (VMI)](https://flex.com/resources/vendor-managed-inventory-vmi): Flex Vendor-Managed Inventory (VMI) programs turn this challenge into advantage by connecting suppliers and production lines through shared data, real-time visibility, and seamless replenishment. By synchronizing planning and execution, VMI helps supply chains act as one—reducing risk, cost, and complexity.
- [IBC conversion ratios: how to choose between 4:1 and 8:1](https://flex.com/resources/ibc-conversion-ratios-how-to-choose-between-41-and-81): Choosing the best IBC conversion ratio and selecting between 4:1 and 8:1 is about which ratio is better for you.
- [Revathi Advaithi: Transformation starts with culture](https://flex.com/resources/revathi-advaithi-transformation-starts-with-culture): In ForbesWomen, Flex's CEO shares how building a strong, inclusive culture is central to Flex’s evolution.
- [Flex named a 2026 World’s Most Ethical Companies® Honoree](https://flex.com/resources/flex-named-a-2026-worlds-most-ethical-companies-honoree): For the fourth year in a row, Flex has been recognized by Ethisphere for advancing ethical business practices worldwide.
- [DC/DC converters for data center applications](https://flex.com/resources/dc-dc-converters-for-data-center-applications): Our extensive portfolio of DC/DC converters are tailored for the unique power requirements of data centers.
- [Press kit: Advancing AI factories with new reference designs and 800 VDC power rack](https://flex.com/resources/press-kit-advancing-ai-factories-with-new-reference-designs-and-800-vdc-power-rack): Modular solutions combine our scale and systems integration expertise with NVIDIA’s AI-driven platform leadership.
- [Prefabricated modular data center solutions](https://flex.com/resources/prefabricated-modular-data-center-solutions): Learn how prefabricated modular solutions accelerate AI, cloud, and edge deployments with scalable solutions.
- [Closing the power efficiency gap in AI data centers](https://flex.com/resources/closing-the-power-efficiency-gap-in-ai-data-centers): Flex CEO Revathi Advaithi on why power efficiency inside AI data centers is critical to AI innovation’s next wave.
- [Networking for AI: Transformation beyond the chip ](https://flex.com/resources/networking-for-ai-transformation-beyond-the-chip): Reducing network bottlenecks during AI data transfer between compute nodes has its challenges. Networking for AI is a three-prong problem: scaling up within the rack, scaling out between racks, and scaling across data center facilities when distributed AI networking is required due to space or power constraints.
- [Protect yourself from fake Flex job opportunities](https://flex.com/resources/protect-yourself-from-fake-flex-job-opportunities)
- [Flex Power Modules selection guide](https://flex.com/resources/flex-power-modules-selection-guide): Explore our catalog of high-density power modules, each the result of extensive research and development in power technology.
- [Flex Power Modules capabilities: Powering your innovation](https://flex.com/resources/flex-power-modules-capabilities-powering-your-innovation): Flex Power Modules brings a long tradition of high-performance board-mounted DC/DC solutions to the telecom, datacom, and industrial marketplaces.
- [DC/DC converters for network security and routers](https://flex.com/resources/dc-dc-converters-for-network-security-and-routers): Learn how our power modules for network security and routers fulfill extremely high quality and reliability requirements.
- [Higher voltage, higher stakes: Prioritizing worker safety in AI data centers](https://flex.com/resources/higher-voltage-higher-stakes-prioritizing-worker-safety-in-ai-data-centers): In a recent call for collaboration, Open Compute Project (OCP) highlighted the need to rethink data center infrastructure as megawatt-scale racks enter the picture and 800 VDC power architectures move closer to becoming the de facto standard. The foundation has proposed establishing workstreams to define the core elements of next-generation data centers, beginning with power, cooling, mechanical, and telemetry protocols. I’d like to propose another: workplace safety.
- [REACH statement of compliance](https://flex.com/resources/reach-statement-of-compliance)
- [The Swedish innovations that power AI](https://flex.com/resources/the-swedish-innovations-that-power-ai): What is it like for businesses developing new technologies in Sweden, and how can they recruit and retain the expertise they need to stay ahead?

## Events
- [Google Cloud Next](https://flex.com/events/google-cloud-next): Gain insights into accelerating transformation, optimizing processes, and enhancing customer experiences with advanced AI technologies.
- [UR MiR | Teradyne Robotics webinar](https://flex.com/events/ur-mir-teradyne-robotics-webinar): Join us as we discuss industry needs, constraints and the factory floor realities of using different types of robotics.
- [NVIDIA GTC](https://flex.com/events/nvidia-gtc-2026): Flex was recognized as a key partner in the NVIDIA AI Factory MGX ecosystem at GTC 2026.
- [AIAG North American Catena-X](https://flex.com/events/aiag-north-american-catena-x): Learn about how we're working with Catena-X to advance ecosystem-wide collaboration and data transparency in the mobility industry.
- [Computex Taipei](https://flex.com/events/computex-taipei): Discover how our end-to-end data center portfolio and integrated solutions are changing what's possible in the AI era.
- [Data Center World](https://flex.com/events/data-center-world): Flex and JetCool will be at Data Center World 2026 in Washington DC. Stop by our booth to learn about our data center and liquid cooling solutions.
- [DCD>Connect | New York](https://flex.com/events/dcdconnect-new-york-2026): We were at DCD>Connect New York to discuss how we are overcoming power, heat, and scale challenges in AI data centers.
- [MD&M West](https://flex.com/events/mdm-west): Join us in Anaheim, California on February 3–5 to see the latest from our health solutions business.
- [CES 2026](https://flex.com/events/ces-2026): From January 6-9 in Las Vegas, our automotive business will be showcasing exciting new innovations in two partner booths: compute for SDVs with Infineon at LVCC’s West Hall and power electronics for xEVs with STMicroelectronics at Wynn.
- [PODD Conference](https://flex.com/events/podd-conference-2025): During his featured session, Greg Panebianco, Sr. Director of Design & Engineering, spoke on connected autoinjectors and our latest drug delivery advances.
- [PDA Universe of Pre-Filled Syringes and Injection Devices Conference](https://flex.com/events/pda-universe-of-pre-filled-syringes-and-injection-devices-conference): Flex gave two podium presentations and a tech talk exploring how we’re driving innovation in drug delivery devices.

## Power Module Series
- [ROA170111](https://flex.com/products/power-modules/series/roa170111): The ROA 170 111 evaluation board facilitates evaluation of the 2x40A BMR4690000 module configured either as a single output, or as a dual output device. It is also possible to use the board to evaluate both single output and dual output configured devices simultaneously.
- [ROA170111/1](https://flex.com/products/power-modules/series/roa170111-1): The ROA 170 111/1 evaluation board facilitates evaluation of the 2x25A BMR4696001 module configured either as a single output, or as a dual output device. It is also possible to use the board to evaluate both single output and dual output configured devices simultaneously.
- [ROA17003](https://flex.com/products/power-modules/series/roa17003): The ROA 170 03 evaluation board provides the possibility to evaluate the BMR 461 series of Digital Point of Load devices from 6-18 A.
- [ROA1285068](https://flex.com/products/power-modules/series/roa1285068): The ROA 128 5068 evaluation board provides the possibility to evaluate Single Inline Package (SIP) variants of the BMR 462, 463 and 464 series of Digital Point of Load devices from 12-50A.
- [ROA1285151](https://flex.com/products/power-modules/series/roa1285151): The ROA 128 5151 evaluation board provides the possibility to evaluate the PIM4328 or PIM4820 series of Power Interface Modules.
- [ROA1283836](https://flex.com/products/power-modules/series/roa1283836): The ROA 128 3836 evaluation board provides the possibility to evaluate the BMR 450, 451, 462, 463 and 464 series of Digital Point of Load devices from 12-50A.
- [ROA17044/4B](https://flex.com/products/power-modules/series/roa17044-4b): The ROA17044/2B evaluation board provides the possibility to evaluate the BMR 466 series of Digital Point of Load devices rated at 60A. This version includes 4 x BMR4668012 devices connected in parallel.
- [ROA17044/2B](https://flex.com/products/power-modules/series/roa17044-2b): The ROA17044/2B evaluation board provides the possibility to evaluate the BMR 466 series of Digital Point of Load devices rated at 60A. This version includes 2 x BMR4668004 devices connected in parallel.
- [ROA1283835](https://flex.com/products/power-modules/series/roa1283835): The ROA 128 3835 evaluation board provides the possibility to evaluate the BMR 453, 454, 456, 457 and 458 series of Digital Intermediate Bus Converters (IBC's).
- [ROA17026/3](https://flex.com/products/power-modules/series/roa17026-3): The ROA 170 26 simple evaluation board provides the possibility to evaluate the 18A BMR4614001 series of Digital Point of Load devices.
- [ROA17026](https://flex.com/products/power-modules/series/roa17026): The ROA 170 26 simple evaluation board provides the possibility to evaluate the 12A BMR4613001 series of Digital Point of Load devices.
- [ROA17026/2](https://flex.com/products/power-modules/series/roa17026-2): The ROA 170 26 simple evaluation board provides the possibility to evaluate the 6A BMR4612001 series of Digital Point of Load devices.
- [FAB8020785](https://flex.com/products/power-modules/series/fab8020785): This product serves as an interface adapter or a bridge between a host PC (IBM™ compatible) and one or multiple PMBus design/evaluation boards via a standard type-A to mini-B USB cable.
- [ROA170163/2](https://flex.com/products/power-modules/series/roa170163-2): This board facilitates evaluation of the 4A PMU8218 Point of Load (PoL) module.
- [ROA170163](https://flex.com/products/power-modules/series/roa170163): This board facilitates evaluation of the 6A PMU8318 Point of Load (PoL) module.
- [ROA170163/4](https://flex.com/products/power-modules/series/roa170163-4): This board facilitates evaluation of the 8A PMU8418 Point of Load (PoL) module.
- [ROA170019](https://flex.com/products/power-modules/series/roa170019): The ROA170019 evaluation board provides the possibility to evaluate the BMR480, BMR490, BMR491 or BMR492 series of High Power Intermediate Bus Converters. It can also be used to do basic power testing for the BMR350/351/352 series, although not all digital functions are compatible.
- [ROA170032](https://flex.com/products/power-modules/series/roa170032): The ROA170032 test board provides the possibility to evaluate the BMR480, BMR490, BMR491, BMR350, BMR351 or BMR352 modules in both parallel and stand alone configurations. Up to 3 modules can be paralleled on the board.
- [ROA170228](https://flex.com/products/power-modules/series/roa170228): The ROA170228 test board facilitates evaluation of the PNA2405S3S non-isolated module.
- [ROA1286016](https://flex.com/products/power-modules/series/roa1286016): The ROA1286016 allows evaluation of the BMR4742001 module which is mounted to the board.
- [ROA170050/3](https://flex.com/products/power-modules/series/roa170050-3): The ROA170050 evaluation board provides the possibility to evaluate the 110A BMR482 series of 48V to Load Direct Conversion products.
- [ROA3200x & ROA3230x](https://flex.com/products/power-modules/series/roa3200x-roa3230x): The Test Boards ROA3200x and ROA3230x can be used for testing of the BMR320 & BMR323 8:1 fixed ratio Intermediate Bus Converters (IBC)
- [ROA170268](https://flex.com/products/power-modules/series/roa170268): The Test Board ROA170268 can be used for testing of the BMR684 DC/DC converter for RFPA applications.
- [ROA170347](https://flex.com/products/power-modules/series/roa170347): The Test Board ROA170347 can be used for testing of the BMR511 Integrated Power Stage for VRM applications.
- [ROA1286012](https://flex.com/products/power-modules/series/roa1286012): The Test Board ROA1286012 can be used for testing of the BMR685 DC/DC converter for RFPA applications. It is also suitable for the PKJ4000 series.
- [ROA1285077](https://flex.com/products/power-modules/series/roa1285077): The Test Board ROA1285077 can be used for paralleling of BMR463 or BMR464 digital Point of Load modules.
- [Flex Power Designer (FPD)](https://flex.com/products/power-modules/series/flex-power-designer-fpd): Flex Power Designer is a FREE to use design tool that enables you to easily and intuitively sketch, simulate, configure and monitor your digital power system, enabling definition of relationships across rails, including phase spreading, sequencing, and fault spreading.
- [ROA170314](https://flex.com/products/power-modules/series/roa170214): The Test Board ROA170314 can be used for testing of the BMR510 Integrated Power Stage for VRM applications.
- [ROA1286023](https://flex.com/products/power-modules/series/roa1286023): The ROA1286023 evaluation board provides the possibility to evaluate the BMR473 series of Digital Point of Load devices delivering up to 40 A per module.
- [ROA170286](https://flex.com/products/power-modules/series/roa170286): The ROA170286 evaluation board provides the possibility to evaluate the BMR316 series of unregulated, non-isolated DC/DC converters.
- [ROA170259](https://flex.com/products/power-modules/series/roa170259): The ROA170259 evaluation board provides the possibility to evaluate the BMR313 or BMR314 series of unregulated, non-isolated DC/DC converters.
- [ROA3210](https://flex.com/products/power-modules/series/roa3210): The Test Board ROA3210 can be used for testing of the BMR321 8:1 fixed ratio Intermediate Bus Converter (IBC)
- [BMR317](https://flex.com/products/power-modules/series/bmr317): The BMR317 is a non‑isolated, unregulated digital Intermediate Bus Converter (IBC) that delivers 800 W continuous power and up to 2 kW peak power in an ultra‑compact footprint measuring just 23.4 × 17.8 × 8.7 mm (L × W × H). With an input range of 40–60 V, its 8:1 conversion ratio provides an output range of 5–7.5 V.
- [RRV](https://flex.com/products/power-modules/series/rrv-series): In partnership with Renesas we have developed the RRV series, which consists of RRV29830 and RRV28830. Both variants share the same footprint 9 x 10 x 5 mm (L x W x H) and deliver a continuous total output current of 40 A per phase or 80 A total, and are capable of delivering a total peak output current of up to 160 A at an output voltage of 0.4-1.8 V. The input voltage range is 3-15 V, which makes them compatible with 4:1 conversion ratio front-end IBCs. Both variants are equipped with Renesas smart power stages.
- [BMR323](https://flex.com/products/power-modules/series/bmr323): The BMR323 is a non-isolated, unregulated Intermediate Bus Converter (IBC) housed in an extremely compact package measuring just 27 x 18 x 6.7 mm (1.06 x 0.71 x 0.26 in), and delivers 600 W of continuous output power and 1,200 W of peak power from an input voltage of 40-60 V. This equates to a power density of up to 368 W/cm3 (6,132 W/in3).
- [BMR352](https://flex.com/products/power-modules/series/bmr352): The BMR352 is a non-isolated digital Intermediate Bus Converter (IBC) with PMBus® interface. The device delivers up to 2000 W of continuous power at efficiency levels of up to 97.9% (measured at half load) in an industry standard quarter brick measuring 58.4 x 36.8 x 14.5 mm (2.3 x 1.45 x 0.58 in) with a flat baseplate which enables simplified conduction cooling to the customers' heatsink or cold plate. Peak power delivery of up to 3000 W (250 A) is available for <0.5s.
- [BMR316](https://flex.com/products/power-modules/series/bmr316): The BMR316 is a non-isolated, unregulated digital IBC (Intermediate Bus Converter) that delivers 1 kW of continuous power, and 2.8 kW of peak power in an ultra-small package measuring just 23.4 x 17.8 x 7.65 mm (LxWxH). Operating over an input voltage range of 38–60 V, the 4:1 input to output ratio results in an output range of 9.5–15 V.
- [BMR321](https://flex.com/products/power-modules/series/bmr321): The BMR321 is a non-isolated, unregulated Intermediate Bus Converter (IBC) housed in a package measuring just 41.47 x 17.67 x 6.9 mm (1.63 x 0.7 x 0.26 in) designed for the OCP OAM v2.0 standard, and delivers 750 W of continuous output power and a peak power of 1,500 W over an input voltage range of 40–60 V.
- [PKJ8200](https://flex.com/products/power-modules/series/pkj8200): The PKJ8200 series is an analog isolated EN50155 compliant DC/DC converter in the industry standard half brick format. They offer a single Vout range between 12-54V. A wide Vin range of 9-75V is offered, making them suitable for 24/36/48V railway applications and a multitude of Industrial applications.
- [BMR511](https://flex.com/products/power-modules/series/bmr511): The BMR511 is a 2-phase intelligent power block which delivers a continuous total output current of 40 A per phase or 80 A total, and is capable of delivering a total peak output current of up to 140 A at an output voltage of 0.5-1.8 V. The input voltage range is 5-15 V, which makes it compatible with 4:1 conversion ratio front-end IBCs. The device delivers an efficiency of 92% at 12 V input / 0.75 V output / 30 A load.
- [BMR351](https://flex.com/products/power-modules/series/bmr351): The BMR351 is a non-isolated digital Intermediate Bus Converter (IBC) with PMBus® interface. The device delivers up to 1,600 W of continuous power at efficiency levels of up to 97.8% (measured at half load) in an industry standard quarter brick measuring 58.4 x 36.8 x 14 mm using an integrated "open deck" baseplate or 14.7 mm using a flat baseplate which enables simplified conduction cooling to the customers' heatsink or cold plate. Peak power delivery of up to 2,320 W (200 A) is available for <0.5s.
- [BMR314](https://flex.com/products/power-modules/series/bmr314): The BMR314 is a non-isolated, unregulated digital IBC (Intermediate Bus Converter) that delivers 800 W of continuous power, and 1.5 kW of peak power in an ultra-small package measuring just 28 x 17.8 x 9.65 mm (LxWxH). Operating over an input voltage range of 38–60 V, the 4:1 input to output ratio results in an output range of 9.5–15 V.
- [BMR684](https://flex.com/products/power-modules/series/bmr684): The BMR684 is a powerful isolated digital DC/DC converter housed in a quarter brick format.
- [BMR320](https://flex.com/products/power-modules/series/bmr320): The BMR320 is a non-isolated, unregulated Intermediate Bus Converter (IBC) housed in an extremely compact package measuring just 27 x 18 x 6.4mm (1.06 x 0.71 x 0.25 in), and delivers 400W of continuous output power from an input voltage of 40-60V. This equates to a power density of 128 W/cm3 (2126 W/in3).
- [BMR313](https://flex.com/products/power-modules/series/bmr313): The BMR313 is a non-isolated, unregulated digital IBC (Intermediate Bus Converter) developed in collaboration with onsemi that delivers 1kW of continuous power, and 3kW of peak power in an ultra-small package measuring just 23.4 x 17.8 x 7.65mm (LxWxH). Operating over an input voltage range of 38-60V, the 4:1 input to output ratio results in an output range of 9.5-15V.
- [BMR473](https://flex.com/products/power-modules/series/bmr473): The BMR473 series is a non-isolated digital DC/DC PoL (Point of Load) regulator that offers exceptional levels of power density for today's most demanding applications. It is available in both a SIP (Single Inline Package) configuration, and a horizontal mount package.
- [BMR520](https://flex.com/products/power-modules/series/bmr520): The BMR5201000 is an isolated Intermediate Bus Converter (IBC) housed in a vertically mounted "power blade" package which minimizes the customer board area needed for the power solution. Each surface mounted power blade delivers up to 300 W at efficiency levels of 94.9% (measured at 53Vin and full load) in a package measuring just 40mm (L) x 17.2mm (W) x 20mm (H), and up to 3 power blades can be connected in parallel to deliver up to 900W of total power in roughly the same board area required by a traditional Quarter Brick package. 1-3 power blades are supported by the external digital controller assembly (BMR5202000/001) measuring just 17 x 17 x 11.6mm, offering PMBus® compatible communications and control features.
- [PUC-BG](https://flex.com/products/power-modules/series/puc-bg): The PUC-BG series is a range of isolated, unregulated 2 W DC/DC converters suitable for the Industrial & Transportation markets, specifically designed for gate drive applications for IGBT, Si and SiC devices.
- [BMR510](https://flex.com/products/power-modules/series/bmr510): The BMR510 is a 2-phase intelligent power block which delivers a continuous total output current of 40 A per phase or 80 A total, and is capable of delivering a total peak output current of up to 160 A at an output voltage of 0.5-1.3 V. The input voltage range is 4.5-15 V, which makes it compatible with 4:1 conversion ratio front-end IBCs. The device delivers an efficiency of more than 90% at 13.5 V input / 0.8 V output / 40 A load.
- [BMR350](https://flex.com/products/power-modules/series/bmr350): The BMR350 is a non-isolated digital Intermediate Bus Converter (IBC) with PMBus® interface. The device delivers up to 1300 W of continuous power at efficiency levels of >97.8% (measured at half load) in an industry standard quarter brick measuring 58.4 x 36.8 x 12 mm, which includes an integrated "open deck" baseplate enabling simplified conduction cooling to the customers' heatsink or cold plate. Peak power delivery of up to 1700 W (140 A) is also possible for short durations (<1s).

## Technical Abbreviations
- [EDPP – Extreme Dynamic Power Profile](https://flex.com/technical-abbreviations/edpp-extreme-dynamic-power-profile): Power-consumption behaviour characterized by very large and rapid load changes over short time periods, typical of AI accelerators and high-performance compute workloads.
- [MPA – Master Purchase Agreement](https://flex.com/technical-abbreviations/mpa-master-purchase-agreement): Framework agreement that defines the general commercial, legal and supply terms governing ongoing purchases between a buyer and supplier.
- [GAE – Grid-Aware Efficiency](https://flex.com/technical-abbreviations/gae-grid-aware-efficiency): Metric that considers both energy efficiency and the carbon intensity or availability of grid power, optimizing operation based on when and how energy is sourced.
- [CPE – Compute Power Efficiency](https://flex.com/technical-abbreviations/cpe-compute-power-efficiency): Metric that evaluates how efficiently electrical power is converted into useful compute work, reflecting the performance output per unit of power consumed.
- [ERE – Energy Reuse Effectiveness](https://flex.com/technical-abbreviations/ere-energy-reuse-effectiveness): Metric that measures how effectively a data center reuses waste energy, calculated by accounting for recovered energy relative to total facility energy consumption.
- [SST – Solid State Transformer](https://flex.com/technical-abbreviations/sst-solid-state-transformer): Power-electronic-based transformer that uses high-frequency conversion and control to provide voltage transformation, isolation, and regulation with improved efficiency, reduced size, and advanced grid-control capabilities.
- [SSCB – Solid State Circuit Breaker](https://flex.com/technical-abbreviations/sscb-solid-state-circuit-breaker): Electronic circuit protection device that uses semiconductor switches to interrupt fault currents rapidly, offering faster response, higher reliability, and arc-free operation compared to mechanical breakers.
- [SIMD – Single Instruction, Multiple Data](https://flex.com/technical-abbreviations/simd-single-instruction-multiple-data): Parallel processing model where a single instruction operates on multiple data elements simultaneously, improving performance for vector and data-parallel workloads.
- [ZIF – Zero Insertion Force](https://flex.com/technical-abbreviations/zif-zero-insertion-force): Socket design allowing ICs to be inserted without pressure, minimizing pin damage.
- [ZEV – Zero Emission Vehicle](https://flex.com/technical-abbreviations/zev-zero-emission-vehicle): Vehicle producing no exhaust emissions during operation, such as electric or hydrogen-powered types.
- [ZCS – Zero Current Switching](https://flex.com/technical-abbreviations/zcs-zero-current-switching): Switching technique where current falls to zero before transition, reducing losses and EMI.
- [ZBFW – Zone-Based Firewall](https://flex.com/technical-abbreviations/zbfw-zone-based-firewall): Security model that groups interfaces into zones and applies policies to traffic between zones rather than to individual interfaces.
- [XR – Extended Reality](https://flex.com/technical-abbreviations/xr-extended-reality): Collective term encompassing AR, VR, and MR immersive technologies.
- [xPU – arbitrary Processing Unit](https://flex.com/technical-abbreviations/xpu-arbitrary-processing-unit): Generic term encompassing all types of compute accelerators - CPU, GPU, DPU, TPU, IPU, and others — used collaboratively in modern AI systems.
- [WSE – Wafer-Scale Engine](https://flex.com/technical-abbreviations/wse-wafer-scale-engine): A processor built on a full silicon wafer, offering extremely high compute density and bandwidth for AI workloads.
- [WBG – Wide Band Gap (semiconductor)](https://flex.com/technical-abbreviations/wbg-wide-band-gap-semiconductor): Class of semiconductors (e.g., SiC, GaN) enabling higher efficiency and voltage operation.
- [VMC – Voltage Mode Control](https://flex.com/technical-abbreviations/vmc-voltage-mode-control): Feedback control system where the output voltage directly determines the PWM duty cycle for regulation.
- [VCO – Voltage Controlled Oscillator](https://flex.com/technical-abbreviations/vco-voltage-controlled-oscillator): Oscillator whose frequency is controlled by an input voltage, key in PLLs and RF systems.
- [UL-MIMO – Ultra-Large-Scale MIMO](https://flex.com/technical-abbreviations/ul-mimo-ultra-large-scale-mimo): Next-generation antenna architecture using thousands of elements to achieve extreme spatial resolution and capacity, primarily in 6G and THz research.
- [UKCA – UK Conformity Assessed](https://flex.com/technical-abbreviations/ukca-uk-conformity-assessed): Post-Brexit product marking confirming compliance with UK regulations, equivalent to the EU’s CE marking.
- [UCIe – Universal Chiplet Interconnect Express](https://flex.com/technical-abbreviations/ucie-universal-chiplet-interconnect-express): Industry standard for die-to-die interconnects enabling chiplet-based architectures with common protocols for compute, memory, and I/O integration.
- [TSV – Through-Silicon Via](https://flex.com/technical-abbreviations/tsv-through-silicon-via): Vertical electrical connection passing through a silicon die to enable stacking in 3D ICs and high-bandwidth memory systems.
- [TR – Technical Report](https://flex.com/technical-abbreviations/tr-technical-report): Document presenting research, data, or standardization findings.
- [TCP – Transport Control Protocol](https://flex.com/technical-abbreviations/tcp-transport-control-protocol): Core Internet protocol providing reliable, ordered data transmission.
- [TCE – Thermal Coefficient of Expansion](https://flex.com/technical-abbreviations/tce-thermal-coefficient-of-expansion): Rate at which a material expands with temperature, critical for matching PCB materials.
- [TAA – Trade Agreements Act](https://flex.com/technical-abbreviations/taa-trade-agreements-act): U.S. legislation requiring that products sold to U.S. federal agencies must be manufactured in the United States or in a designated “TAA-compliant” country; affects sourcing, procurement, and approved supplier lists.
- [SWaP-C – Size, Weight, Power, and Cost](https://flex.com/technical-abbreviations/swap-c-size-weight-power-and-cost): Key design trade-off metric balancing physical and efficiency constraints.
- [SSO – Single Sign-On](https://flex.com/technical-abbreviations/sso-single-sign-on): Authentication method that allows users to access multiple systems or applications with one set of login credentials.
- [SR – Series Resonance](https://flex.com/technical-abbreviations/sr-series-resonance): Condition in which inductive and capacitive reactance’s cancel, minimizing impedance.
- [SPU – Security Processing Unit](https://flex.com/technical-abbreviations/spu-security-processing-unit): Dedicated processor providing encryption, authentication, and secure data management for system protection.
- [SPC – Statistical Process Control](https://flex.com/technical-abbreviations/spc-statistical-process-control): Technique using statistical data to monitor and control manufacturing variation, improving process stability.
- [SMR – Small Modular Reactor](https://flex.com/technical-abbreviations/smr-small-modular-reactor): Compact, factory-built nuclear fission reactor designed for modular deployment, typically producing 50–300 MW per unit, offering high energy density, stable baseload output and improved safety features compared to large-scale reactors.
- [SIOP – Sales, Inventory, and Operations Planning](https://flex.com/technical-abbreviations/siop-sales-inventory-and-operations-planning): Integrated business process aligning sales forecasts, inventory, and production capacity to balance demand and supply.
- [SIMT – Single Instruction, Multiple Threads](https://flex.com/technical-abbreviations/simt-single-instruction-multiple-threads): GPU execution model (used in CUDA) where groups of threads execute the same instruction simultaneously on different data, enabling massive parallelism.
- [SiC – Silicon Carbide](https://flex.com/technical-abbreviations/sic-silicon-carbide): Wide bandgap semiconductor enabling high-efficiency, high-temperature power devices.
- [SDDC – Software Defined Data Center](https://flex.com/technical-abbreviations/sddc-software-defined-data-center): Data center where compute, storage, and networking are virtualized and delivered as a service.
- [SCPD – Short Circuit Protective Device](https://flex.com/technical-abbreviations/scpd-short-circuit-protective-device): External protection component, such as a fuse or circuit breaker, ensuring circuit isolation under fault conditions.
- [SBC – Single Board Computer or Session Border Controller](https://flex.com/technical-abbreviations/sbc-single-board-computer-or-session-border-controller): Complete computer built on a single PCB with processor, memory, and I/O / Network device that manages and secures real-time voice and video communications (VoIP or SIP), controlling signaling, media, and security across IP network borders.
- [SAML – Security Assertion Markup Language](https://flex.com/technical-abbreviations/saml-security-assertion-markup-language): Open standard for exchanging authentication and authorization data between identity providers and applications, commonly used for single sign-on (SSO) in enterprise systems.
- [RS – Recommended Standard (e.g., RS232, RS485)](https://flex.com/technical-abbreviations/rs-recommended-standard-e-g-rs232-rs485): Serial communication standard ensuring interoperability between devices.
- [RRU – Remote Radio Unit](https://flex.com/technical-abbreviations/rru-remote-radio-unit): RAN component containing RF circuits, co-located with or integrated into the antenna.
- [RPU – Resistive Processing Unit](https://flex.com/technical-abbreviations/rpu-resistive-processing-unit): A processor that performs computing inside resistive memory cells (in-memory computing) to reduce power and data movement for AI.
- [RPM – Revolutions Per Minute](https://flex.com/technical-abbreviations/rpm-revolutions-per-minute): Rotational speed measure for fans, drives, and mechanical systems.
- [RNN – Recurrent Neural Network](https://flex.com/technical-abbreviations/rnn-recurrent-neural-network): Type of neural network designed to process sequential data by maintaining an internal state (“memory”) across time steps, making it suitable for tasks such as language modeling, time-series analysis and speech processing.
- [RMI – Responsible Minerals Initiative](https://flex.com/technical-abbreviations/rmi-responsible-minerals-initiative): Industry program that promotes responsible sourcing of minerals by providing tools, standards, and audit frameworks to help companies ensure conflict-free and ethically sourced materials in their supply chains.
- [RISC-V – Reduced Instruction Set Computer (Version 5 architecture)](https://flex.com/technical-abbreviations/risc-v-reduced-instruction-set-computer-version-5-architecture): Open, extensible instruction-set architecture (ISA) based on RISC principles, allowing companies to design custom processors without licensing fees; widely used in AI accelerators, embedded systems, and edge compute.
- [RH – Relative Humidity](https://flex.com/technical-abbreviations/rh-relative-humidity): Measure of moisture in air relative to its saturation point, affecting cooling and materials.
- [REACH – Registration, Evaluation, Authorization, and restriction of CHemicals](https://flex.com/technical-abbreviations/reach-registration-evaluation-authorization-and-restriction-of-chemicals): EU regulation controlling chemicals and their safe use.
- [RAG – Retrieval-Augmented Generation](https://flex.com/technical-abbreviations/rag-retrieval-augmented-generation): An AI technique where a model retrieves relevant external information (e.g., from a database or documents) and uses it to generate more accurate and grounded responses.
- [QPU – Quantum Processing Unit](https://flex.com/technical-abbreviations/qpu-quantum-processing-unit): Specialized processor that uses quantum bits (qubits) to perform computations based on quantum mechanics, enabling certain problem types—such as optimization, simulation, and cryptography—to be solved more efficiently than with classical processors.

## Component Meta
- [Product Attributes](https://flex.com/component_meta/product-attributes)
- [Unregulated/Fixed Ratio](https://flex.com/component_meta/unregulated-fixed-ratio)
- [Regulated](https://flex.com/component_meta/regulated)
- [Non-Isolated](https://flex.com/component_meta/non-isolated)
- [Isolated](https://flex.com/component_meta/isolated)
- [Status](https://flex.com/component_meta/status)
- [Isolation](https://flex.com/component_meta/isolation)
- [Regulation](https://flex.com/component_meta/regulation)
- [Digital Interfaces](https://flex.com/component_meta/digital-interfaces)
- [Input Voltage](https://flex.com/component_meta/input-voltage)
- [Output Voltage](https://flex.com/component_meta/output-voltage)
- [Input Voltage (min)](https://flex.com/component_meta/input-voltage-min)
- [Input Voltage (max)](https://flex.com/component_meta/input-voltage-max)
- [Output Voltage (typical)](https://flex.com/component_meta/output-voltage-typical)
- [Output Voltage (min)](https://flex.com/component_meta/output-voltage-min)
- [Output Voltage (max)](https://flex.com/component_meta/output-voltage-max)
- [Output Power](https://flex.com/component_meta/output-power)
- [Output Current](https://flex.com/component_meta/output-current)
- [Product Type](https://flex.com/component_meta/product-type)
- [Product Type](https://flex.com/component_meta/product-type-2)
- [Subtype](https://flex.com/component_meta/subtype)
- [Paralleling](https://flex.com/component_meta/paralleling)
- [Isolation Voltage](https://flex.com/component_meta/isolation-voltage)
- [Size](https://flex.com/component_meta/size)
- [Multi-Output](https://flex.com/component_meta/multi-output)
- [Telecom](https://flex.com/component_meta/telecom)
- [RFPA](https://flex.com/component_meta/rfpa)
- [Data Center and Cloud](https://flex.com/component_meta/data-center-and-cloud)
- [Industrial](https://flex.com/component_meta/industrial)
- [Transportation and railway](https://flex.com/component_meta/transportation-and-railway)
- [Legacy ID](https://flex.com/component_meta/legacy-id)
- [Series Ref](https://flex.com/component_meta/series-ref)
- [Series Image](https://flex.com/component_meta/series-image)
- [Image Override](https://flex.com/component_meta/image-override)
- [Series](https://flex.com/component_meta/component-series)
- [Output Power (Peak)](https://flex.com/component_meta/output-power-peak)
- [Output Current (Peak)](https://flex.com/component_meta/output-current-peak)
- [Typical Efficiency](https://flex.com/component_meta/typical-efficiency)
- [Length](https://flex.com/component_meta/length)
- [Width](https://flex.com/component_meta/width)
- [Height](https://flex.com/component_meta/height)
- [Package Footprint](https://flex.com/component_meta/package-footprint)
- [Package Type](https://flex.com/component_meta/package-type)
- [Mounting Type](https://flex.com/component_meta/mounting-type)
- [Application](https://flex.com/component_meta/application)
- [Base Model Name](https://flex.com/component_meta/base-model-name)
- [Material Name](https://flex.com/component_meta/material-name-2)
- [Release Date](https://flex.com/component_meta/release-date)
- [Application Keywords](https://flex.com/component_meta/application-keywords)
- [Power Module Type](https://flex.com/component_meta/power-module-type)

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