{"id":43580,"date":"2026-10-08T11:26:52","date_gmt":"2026-10-08T16:26:52","guid":{"rendered":"https:\/\/flex.com\/?post_type=resource&#038;p=43580"},"modified":"2026-10-08T11:26:55","modified_gmt":"2026-10-08T16:26:55","slug":"cooling-custom-silicon-at-scale","status":"publish","type":"resource","link":"https:\/\/flex.com\/de\/resources\/cooling-custom-silicon-at-scale","title":{"rendered":"K\u00fchlung von kundenspezifischen Siliziuml\u00f6sungen im gro\u00dfen Ma\u00dfstab"},"content":{"rendered":"<div id=\"overscroll-top\" style=\"background-color: #eaeef4;\"><\/div>\n<div class=\"resource-header block\">\n\t<div class=\"container\">\n\t\t<div class=\"breadcrumb\">\n\t\t\t<a title=\"Homepage\" href=\"\/\">Flex<\/a>\n\t\t\t<svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" viewBox=\"0 0 384 512\"><path d=\"M365.3 256l-22.6 22.6-192 192L128 493.3 82.7 448l22.6-22.6L274.7 256 105.4 86.6 82.7 64 128 18.7l22.6 22.6 192 192L365.3 256z\"\/><\/svg>\n\t\t\t<a title=\"Resources\" href=\"\/resources\">Resources<\/a>\n\t\t\t<svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" viewBox=\"0 0 384 512\"><path d=\"M365.3 256l-22.6 22.6-192 192L128 493.3 82.7 448l22.6-22.6L274.7 256 105.4 86.6 82.7 64 128 18.7l22.6 22.6 192 192L365.3 256z\"\/><\/svg>\n\t\t\t<a title=\"Cooling custom silicon at scale\">Cooling custom silicon at scale<\/a>\n\t\t<\/div>\n\t\t<h1>Cooling custom silicon at scale<\/h1>\n\t\t\t\t<div class=\"separator\"><\/div>\n\t\t<div class=\"details\">\n\t\t\t\t\t\t\t\t\t<div class=\"date detail\">\n\t\t\t\tPosted on<br>\n\t\t\t\tOktober 8, 2026\t\t\t<\/div>\n\t\t\t\t\t\t<div class=\"categories\">\n\t\t\t\t<div class=\"categories-wrapper\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<span class=\"cat-tag\">Blog<\/span>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\n\t\t\t\t\t\t\t\t\t\t\t\t\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<a class=\"cat-tag\" data-cat-level=\"2\" data-destination=\"https:\/\/flex.com\/industries\/data-center#resources\" href=\"https:\/\/flex.com\/industries\/data-center#resources\">Data Center<\/a>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\n\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t<\/div>\n<\/div>\n\n\n\n<div class=\"sidebar block normal-sidebar\">\n\t<div class=\"container\">\n\t\t<div class=\"content\">\n\t\t\t\n\n<h2 class=\"wp-block-heading has-medium-font-size\">As AI processors become more specialized, thermal architectures must balance silicon-level optimization with infrastructure-level standardization<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">AI infrastructure is moving in two directions at once. At the silicon level, hyperscalers are increasing investment in custom accelerators optimized for specific workloads, system architectures, and performance objectives. At the data center level, the industry is pursuing greater standardization and interoperability across racks, power, cooling, networking, and other infrastructure.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Custom silicon is gaining ground quickly. Counterpoint Research expects <a href=\"https:\/\/counterpointresearch.com\/en\/insights\/AI-Server-Compute-ASIC-Shipments-to-Triple-by-2027\" target=\"_blank\" rel=\"noreferrer noopener nofollow\">AI server compute ASIC shipments<\/a> among the top 10 players to triple between 2024 and 2027, driven by Google TPU infrastructure, AWS Trainium clusters, and growing deployments of Meta MTIA and Microsoft Maia. TrendForce likewise reports increasing <a href=\"https:\/\/www.trendforce.com\/presscenter\/news\/20260225-12934.html\" target=\"_blank\" rel=\"noreferrer noopener nofollow\">cloud service provider (CSP) investment in ASICs<\/a> to improve workload suitability and data center cost efficiency.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Custom silicon is not replacing merchant GPUs outright. Hyperscalers continue to invest heavily in GPU platforms even as they expand their own silicon programs, creating a more heterogeneous compute environment. TrendForce expects Google and AWS to ramp their next-generation in-house ASIC platforms in the second half of 2026, while demand for NVIDIA rack-scale systems remains strong.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">That creates a practical design challenge: creating cooling that is tailored to the specific thermal demands of each processor, and fits into standardized infrastructure that can be scaled across large deployments.<\/p>\n\n\n\t\t<\/div>\n\t\t<div class=\"sidebar normal-column\">\n\t\t\t\t\t\t\t\t\t<div class=\"post\">\n\t\t\t\t\t\t\t\t<a title=\"The vertically integrated E-house\u00a0\" class=\"image\" href=\"https:\/\/flex.com\/de\/resources\/the-vertically-integrated-e-house\" target=\"_self\">\n\t\t\t\t\t\t\t\t\t\t<img decoding=\"async\" alt=\"Vertically integrated E-house exterior\" src=\"https:\/\/flex.com\/wp-content\/uploads\/2026\/10\/E-House-Exterior-540x304.png\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<div class=\"label\">\n\t\t\t\t\t\t\tBlog\t\t\t\t\t\t<\/div>\n\t\t\t\t\t\t\t\t\t<\/a>\n\t\t\t\t<a title=\"The vertically integrated E-house\u00a0\" class=\"title\" href=\"https:\/\/flex.com\/de\/resources\/the-vertically-integrated-e-house\" target=\"_self\">\n\t\t\t\t\tThe vertically integrated E-house\u00a0\t\t\t\t<\/a>\n\t\t\t<\/div>\n\t\t\t\t\t\t<div class=\"post\">\n\t\t\t\t\t\t\t\t<a title=\"Matching IBC architectures to AI data center load profiles\" class=\"image\" href=\"https:\/\/flex.com\/de\/resources\/matching-ibc-architectures-to-ai-data-center-load-profiles\" target=\"_self\">\n\t\t\t\t\t\t\t\t\t\t<img decoding=\"async\" alt=\"Matching IBC architectures to AI data center load profiles\" src=\"https:\/\/flex.com\/wp-content\/uploads\/2026\/09\/Center-Server-Racks-540x304.jpg\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<div class=\"label\">\n\t\t\t\t\t\t\tBlog\t\t\t\t\t\t<\/div>\n\t\t\t\t\t\t\t\t\t<\/a>\n\t\t\t\t<a title=\"Matching IBC architectures to AI data center load profiles\" class=\"title\" href=\"https:\/\/flex.com\/de\/resources\/matching-ibc-architectures-to-ai-data-center-load-profiles\" target=\"_self\">\n\t\t\t\t\tMatching IBC architectures to AI data center load profiles\t\t\t\t<\/a>\n\t\t\t<\/div>\n\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t<\/div>\n<\/div>\n\n<div id=\"id-6ac86a0bcd93a\" class=\"box block full-width dark-content de \" style=\"background-color: transparent; background-image: none;\">\n\t<style>\n\t\t#id-6ac86a0bcd93a > .container > .content {\n\t\t\tbackground-color: transparent;\n\t\t\tposition: relative;\n\t\t\tpadding-top: 48px;\n\t\t\tpadding-right: 0px;\n\t\t\tpadding-bottom: 96px;\n\t\t\tpadding-left: 0px;\n\t\t\tmargin-left: 0px;\n\t\t\tmargin-right: 0px;\n\t\t}\n\t\t@media (max-width: 1272px) {\n\t\t\t#id-6ac86a0bcd93a.box.block.full-width > .container > .content {\n\t\t\t\tpadding-left: 0 !important;\n\t\t\t\tpadding-right: 0 !important;\n\t\t\t\tmargin: 0 !important;\n\t\t\t}\n\t\t}\n\t\t@media (max-width: 960px) {\n\t\t\t#id-6ac86a0bcd93a > .container > .content {\n\t\t\t\t\/\/padding-top: 24px;\n\t\t\t\tpadding-right: 0px;\n\t\t\t\t\/\/padding-bottom: 48px;\n\t\t\t\tpadding-left: 0px;\n\t\t\t}\n\t\t}\n\t<\/style>\n\t<div class=\"container\">\n\t\t<div class=\"content\">\n\t\t\t\n\n<h2 class=\"wp-block-heading\">Cooling starts at the silicon<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">The cooling requirements of an AI accelerator are not defined by its power consumption. A 1,500-watt package is not simply a 1,500-watt heat load. Engineers must understand where those watts originate and how heat travels from the silicon through the package because two processors consuming equal amounts of power may have very different cooling requirements. Silicon thermal signatures depend on die configuration, the location and intensity of compute cores, hot spots, high-bandwidth memory placement, package construction, thermal resistance, and allowable operating temperatures. Modern AI accelerators may also combine multiple compute dies, memory stacks, interposers, and other components within a single package, and different components may have different thermal limits.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">McKinsey notes that <a href=\"https:\/\/www.mckinsey.com\/industries\/technology-media-and-telecommunications\/our-insights\/the-7-trillion-dollar-data-center-build-out-how-industrials-can-capture-their-share?\" target=\"_blank\" rel=\"noreferrer noopener nofollow\">GPU and custom silicon architectures<\/a> establish power density, thermal, and interconnect requirements years in advance, making cooling part of the compute architecture. Cooling development can begin before production silicon is available. Thermal test vehicles (TTVs) modeled on the expected characteristics of a future processor can simulate its heat distribution and other relevant package characteristics, allowing engineers to physically test and refine cooling solutions while silicon development is still underway. That puts cooling and silicon development on parallel paths.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Design the cold plate around the processor<\/h2>\n\n\n<div id=\"id_6ac86a0bc1a8a\" class=\"media block\">\n\t<div class=\"container media-right content-top\">\n\t\t<div class=\"media\" style=\"left: 0px; min-width: 516px; max-width: 516px;\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<div class=\"image none\">\n\t\t\t\t\t\t\t<img decoding=\"async\" alt=\"Cooling custom silicon at scale\" src=\"https:\/\/flex.com\/wp-content\/uploads\/2026\/10\/1200x628_SmartLid-Silicon-Chip.png\">\n\t\t\t\t\t\t<\/div>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t\t<div class=\"content\" style=\"margin-right: 48px; margin-left: 0px;\">\n\t\t\t\t\n\n<p class=\"wp-block-paragraph\">For many advanced CPUs, GPUs, ASICs, networking devices, and AI accelerators, the <a href=\"https:\/\/jetcool.com\/smartplate-cold-plate\/\" target=\"_blank\" rel=\"noreferrer noopener nofollow\">cold plate<\/a> is the first place where silicon-specific cooling becomes real hardware. It has to match the thermal profile of the package, but it also has to work within the mechanical, fluid, and integration constraints of the platform.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">That means the design is not just about removing more heat. 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Flow paths, microconvection impingement features, materials, mounting approach, and thermal interfaces are used to create a solution that addresses the areas that need the most cooling, or specific types of cooling. That is especially important for custom silicon, where die placement, memory location, package construction, and allowable temperatures can vary significantly from one design to the next. <a href=\"https:\/\/investors.flex.com\/news\/news-details\/2026\/JetCool-Collaborates-with-Broadcom-to-Deliver-Innovative-Liquid-Cooling-for-Next-Generation-AI-XPUs\/default.aspx\" target=\"_blank\" rel=\"noreferrer noopener\">JetCool and Broadcom<\/a>, for example, recently announced a direct-to-chip cooling solution for next-generation custom AI XPUs designed to support sustained multi-kilowatt ASIC operation at heat flux levels reaching 4 W\/mm<span class=\"sup\">2<\/span>.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">That kind of expert design work is where customization delivers value. The cold plate is engineered around the processor\u2019s thermal and mechanical requirements, while also accounting for the operating conditions of the rack, CDU, and facility water system. This holistic silicon-to-facility approach to cooling design helps data centers improve power and water efficiency, increase density, and maintain performance under peak workloads.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Standardize the boundaries. Differentiate within them.<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">At hyperscale, small improvements in performance per watt, utilization, or workload economics can multiply across large fleets. That helps explain the investment in specialized silicon. McKinsey estimates that customized chips could reduce cost per token by 70 percent to 80 percent for the inference workloads they are designed to handle.<\/p>\n\n\n\n<div id=\"id-6ac86a0bc83b3\" class=\"columns-grid block\">\n\t<style>\n\t\t\/* === Frontend Grid === *\/\n\t\tbody:not(.block-editor-page) #id-6ac86a0bc83b3 > .container {\n\t\t\tdisplay: grid;\n\t\t\tgrid-template-columns: 2fr 1fr;\n\t\t\tgap: 24px;\n\t\t}\n\t\t\n\t\t\/* Column padding *\/\n\t\t#id-6ac86a0bc83b3 .column,\n\t\t#id-6ac86a0bc83b3 .wp-block-acf-column {\n\t\t\tpadding: 0;\n\t\t}\n\t\t\n\t\t\/* Rules between columns *\/\n\t\t#id-6ac86a0bc83b3 > .container.show-rules .column + .column,\n\t\t#id-6ac86a0bc83b3 > .container.show-rules .wp-block-acf-column + .wp-block-acf-column {\n\t\t\tborder-left: 1px solid rgba(38, 38, 38, 0.2);\n\t\t}\n\t\t\n\t\t\/* Max width for nested widgets *\/\n\t\t#id-6ac86a0bc83b3 .column .code.block .container .tagembed-widget,\n\t\t#id-6ac86a0bc83b3 .wp-block-acf-column .code.block .container .tagembed-widget {\n\t\t\tmax-width: 600px;\n\t\t}\n\t\t\n\t\t\/* === Editor Overrides === *\/\n\t\tbody.block-editor-page #id-6ac86a0bc83b3 > .container > .block-editor-inner-blocks > .block-editor-block-list__layout {\n\t\t\tdisplay: grid !important;\n\t\t\tgrid-template-columns: 2fr 1fr !important;\n\t\t\tgap: 24px !important;\n\t\t}\n\t\t\n\t\tbody.block-editor-page #id-6ac86a0bc83b3 .wp-block-acf-column {\n\t\t\twidth: 100% !important;\n\t\t\tbox-sizing: border-box;\n\t\t}\n\t\t\n\t\t\/* Mobile responsiveness *\/\n\t\t@media (max-width: 1320px) {\n\t\t\t#id-6ac86a0bc83b3 > .container {\n\t\t\t\tdisplay: block !important;\n\t\t\t\tmax-width: 600px;\n\t\t\t}\n\t\t\t#id-6ac86a0bc83b3 > .container > .column,\n\t\t\t#id-6ac86a0bc83b3 > .container > .wp-block-acf-column {\n\t\t\t\tpadding: 24px 0 0 0 !important;\n\t\t\t}\n\t\t\t#id-6ac86a0bc83b3 > .container > .column:first-child,\n\t\t\t#id-6ac86a0bc83b3 > .container > .wp-block-acf-column:first-child {\n\t\t\t\tpadding: 0 !important;\n\t\t\t}\n\t\t\t#id-6ac86a0bc83b3 > .container.show-rules .column + .column,\n\t\t\t#id-6ac86a0bc83b3 > .container.show-rules .wp-block-acf-column + .wp-block-acf-column {\n\t\t\t\tborder-left: none;\n\t\t\t\tborder-top: 1px solid rgba(38, 38, 38, 0.2);\n\t\t\t\tpadding: 30px 0 0 0 !important;\n\t\t\t\tmargin-top: 30px;\n\t\t\t}\n\t\t}\n\t<\/style>\n\t<div class=\"container align-center\">\n\t\t\n<div class=\"column block\">\n\t\n\n<p class=\"wp-block-paragraph\">The challenge is that processor-specific optimization cannot turn the rest of the infrastructure into a one-off design. At the silicon, cooling can be tuned to the heat map, package design, and thermal limits of a specific processor. Farther from the chip, common approaches to fluid connections, operating conditions, manifolds, racks, CDUs, facility water systems, and telemetry allow different types and generations of compute to coexist in production, increasing density and simplifying deployment.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Standardization does not eliminate customization. It defines where customization belongs. With expert design, the most processor-specific work can stay close to the silicon while the rack and facility infrastructure remain consistent to support repeatable deployment at scale. As custom compute becomes more common, that boundary becomes more important.<\/p>\n\n\n<\/div>\n\n<div class=\"column block\">\n\t\n<div id=\"id-6ac86a0bc828c\" class=\"box block content-width light-content de \" style=\"background-color: transparent; background-image: none;\">\n\t<style>\n\t\t#id-6ac86a0bc828c > .container > .content {\n\t\t\tbackground-color: #005486ff;\n\t\t\tposition: relative;\n\t\t\tpadding-top: 12px;\n\t\t\tpadding-right: 12px;\n\t\t\tpadding-bottom: 12px;\n\t\t\tpadding-left: 12px;\n\t\t\tmargin-left: 0px;\n\t\t\tmargin-right: 0px;\n\t\t}\n\t\t@media (max-width: 1272px) {\n\t\t\t#id-6ac86a0bc828c.box.block.full-width > .container > .content {\n\t\t\t\tpadding-left: 0 !important;\n\t\t\t\tpadding-right: 0 !important;\n\t\t\t\tmargin: 0 !important;\n\t\t\t}\n\t\t}\n\t\t@media (max-width: 960px) {\n\t\t\t#id-6ac86a0bc828c > .container > .content {\n\t\t\t\t\/\/padding-top: 6px;\n\t\t\t\tpadding-right: 6px;\n\t\t\t\t\/\/padding-bottom: 6px;\n\t\t\t\tpadding-left: 6px;\n\t\t\t}\n\t\t}\n\t<\/style>\n\t<div class=\"container\">\n\t\t<div class=\"content\">\n\t\t\t\n<div id=\"id-6ac86a0bc7a05\" class=\"box block content-width dark-content de \" style=\"background-color: transparent; background-image: none;\">\n\t<style>\n\t\t#id-6ac86a0bc7a05 > .container > .content {\n\t\t\tbackground-color: #ffffffff;\n\t\t\tposition: relative;\n\t\t\tpadding-top: 1px;\n\t\t\tpadding-right: 1px;\n\t\t\tpadding-bottom: 1px;\n\t\t\tpadding-left: 1px;\n\t\t\tmargin-left: 0px;\n\t\t\tmargin-right: 0px;\n\t\t}\n\t\t@media (max-width: 1272px) {\n\t\t\t#id-6ac86a0bc7a05.box.block.full-width > .container > .content {\n\t\t\t\tpadding-left: 0 !important;\n\t\t\t\tpadding-right: 0 !important;\n\t\t\t\tmargin: 0 !important;\n\t\t\t}\n\t\t}\n\t\t@media (max-width: 960px) {\n\t\t\t#id-6ac86a0bc7a05 > .container > .content {\n\t\t\t\t\/\/padding-top: 0.5px;\n\t\t\t\tpadding-right: 0.5px;\n\t\t\t\t\/\/padding-bottom: 0.5px;\n\t\t\t\tpadding-left: 0.5px;\n\t\t\t}\n\t\t}\n\t<\/style>\n\t<div class=\"container\">\n\t\t<div class=\"content\">\n\t\t\t\n<div id=\"id-6ac86a0bc6b9e\" class=\"box block content-width light-content de \" style=\"background-color: transparent; background-image: none;\">\n\t<style>\n\t\t#id-6ac86a0bc6b9e > .container > .content {\n\t\t\tbackground-color: #005486ff;\n\t\t\tposition: relative;\n\t\t\tpadding-top: 24px;\n\t\t\tpadding-right: 12px;\n\t\t\tpadding-bottom: 24px;\n\t\t\tpadding-left: 12px;\n\t\t\tmargin-left: 0px;\n\t\t\tmargin-right: 0px;\n\t\t}\n\t\t@media (max-width: 1272px) {\n\t\t\t#id-6ac86a0bc6b9e.box.block.full-width > .container > .content {\n\t\t\t\tpadding-left: 0 !important;\n\t\t\t\tpadding-right: 0 !important;\n\t\t\t\tmargin: 0 !important;\n\t\t\t}\n\t\t}\n\t\t@media (max-width: 960px) {\n\t\t\t#id-6ac86a0bc6b9e > .container > .content {\n\t\t\t\t\/\/padding-top: 12px;\n\t\t\t\tpadding-right: 6px;\n\t\t\t\t\/\/padding-bottom: 12px;\n\t\t\t\tpadding-left: 6px;\n\t\t\t}\n\t\t}\n\t<\/style>\n\t<div class=\"container\">\n\t\t<div class=\"content\">\n\t\t\t\n\n<h3 class=\"wp-block-heading has-text-align-center has-small-font-size\" style=\"font-weight:400\"><span class=\"font-size-30\" style=\"font-weight:600;\">Customize<\/span> where physics and performance <span class=\"font-size-30\" style=\"font-weight:600;\"><em>demand&nbsp;it<\/em><\/span>.<\/h3>\n\n\n\n<h3 class=\"wp-block-heading has-text-align-center has-small-font-size\" style=\"font-weight:400\"><span class=\"font-size-30\" style=\"font-weight:600;\">Standardize<\/span> where repeatability and scale <span class=\"font-size-30\" style=\"font-weight:600;\"><em>depend on&nbsp;it<\/em><\/span>.<\/h3>\n\n\n\t\t<\/div>\n\t<\/div>\n<\/div>\n\n\n\t\t<\/div>\n\t<\/div>\n<\/div>\n\n\n\t\t<\/div>\n\t<\/div>\n<\/div>\n\n\n<\/div>\n\n\t<\/div>\n<\/div>\n\n\n<h2 class=\"wp-block-heading\">Turn custom cooling into repeatable infrastructure<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">There is a big difference between engineering a cold plate that works and manufacturing a thermal system that can be reproduced at full scale. Internal channel geometry, flatness, surface finish, joining processes, material compatibility, cleanliness, pressure integrity, thermal-interface consistency, and flow distribution all affect final cold plate performance. In development, small variations can often be studied, adjusted, or managed by engineering. At production scale, those same variations have to be controlled across thousands of servers and potentially hundreds of thousands of processors.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">That makes <a href=\"https:\/\/flex.com\/solutions-and-services\/manufacturing\" data-type=\"page\" data-id=\"43\">manufacturing capability<\/a> part of the cooling solution, not a handoff after the design is finished. Leak and pressure testing, flow characterization, thermal validation, cleanliness controls, and process monitoring all need to scale with production. They have to provide confidence in every unit without slowing the line or turning validation into a bottleneck.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">For processor-specific cooling, that gap between prototype and production is especially important. A cold plate tuned to a particular heat map has to reproduce the intended flow and cooling behavior consistently as volume increases, while still connecting cleanly to manifolds, racks, CDUs, and facility water systems. The custom silicon provider needs a partner that can do both: engineer the cooling architecture around the processor and build it with the process control, repeatability, and scale required for deployment.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Engineer the system from chip to facility<\/h2>\n\n\n<div id=\"id_6ac86a0bca497\" class=\"media block\">\n\t<div class=\"container media-left content-center\">\n\t\t<div class=\"media\" style=\"left: 0px; min-width: 492px; max-width: 492px;\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<div class=\"image none\">\n\t\t\t\t\t\t\t<img decoding=\"async\" alt=\"Custom silicon cooling designed at the chip level\" src=\"https:\/\/flex.com\/wp-content\/uploads\/2026\/10\/1200x628_SmartSilicon_.png\">\n\t\t\t\t\t\t<\/div>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t\t<div class=\"content\" style=\"margin-right: 0px; margin-left: 24px;\">\n\t\t\t\t\n\n<p class=\"wp-block-paragraph\">AI infrastructure now depends on decisions made across the full stack: silicon, packaging, power delivery, cooling, mechanical design, manufacturing, and facilities. 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We appreciate your patience and look forward to sharing it with you soon.<\/p>\n\t\t\t\t\t<\/div>\n\t\t\t\t`;\n\t\t\t\tmediaVideoElement.appendChild(errorDiv);\n\t\t\t}\n\t\t}\n\t\t\n\t\tfunction runVideoInjection() {\n\t\t\tif (hasRun_id_6ac86a0bca497) return;\n\t\t\thasRun_id_6ac86a0bca497 = true;\n\t\t\tupdateVideoDisplay_id_6ac86a0bca497();\n\t\t}\n\t\t\n\t\t\/\/ Always run on front-end\n\t\tif (document.readyState === 'loading') {\n\t\t\tdocument.addEventListener('DOMContentLoaded', runVideoInjection);\n\t\t} else {\n\t\t\trunVideoInjection();\n\t\t}\n\t\t\n\t\t\/\/ Also run in editor if available\n\t\tif (typeof wp !== 'undefined' && wp.domReady) {\n\t\t\twp.domReady(runVideoInjection);\n\t\t}\n\t})();\n\t<\/script>\n\t\n\t<script>\n\t\tdocument.addEventListener('DOMContentLoaded', function () {\n\t\t\t\n\t\t\t\/\/ Get the block element by ID\n\t\t\tvar blockElement = document.getElementById(\"id_6ac86a0bca497\");\n\t\t\tif (!blockElement) return;\n\t\n\t\t\t\/\/ Reveal the block\n\t\t\t(function ($) {\n\t\t\t\tScrollReveal().reveal(blockElement.querySelector(\".container .media\"), {origin: \"bottom\", distance: \"20px\", opacity: 1, duration: 1000});\n\t\t\t\tScrollReveal().reveal(blockElement.querySelector(\".container .content\"), {origin: \"bottom\", distance: \"20px\", opacity: 1, duration: 1000});\n\t\t\t}(jQuery));\n\t\t});\n\t<\/script>\n<\/div>\n\n<div class=\"spacer block\" style=\"height: 24px;\">\n\t<\/div>\n\n\n<p class=\"wp-block-paragraph\">Our AI infrastructure capabilities span <a href=\"https:\/\/jetcool.com\/custom-cooling\/\" rel=\"nofollow noopener\" target=\"_blank\">processor-specific cold plates and direct-to-chip liquid cooling<\/a> through manifolds, CDUs, IT racks, embedded and critical power, and integrated data center infrastructure. Combined with systems engineering and <a href=\"https:\/\/flex.com\/solutions-and-services\/manufacturing\" data-type=\"page\" data-id=\"43\">advanced manufacturing at scale<\/a>, that breadth creates a path from a cooling solution tuned to the heat map of a particular processor to repeatable rack- and facility-level infrastructure and high-volume deployment.<\/p>\n\n\n<div class=\"spacer block\" style=\"height: 24px;\">\n\t<\/div>\n\n<div id=\"id-6ac86a0bcd320\" class=\"box block content-width dark-content de \" style=\"background-color: transparent; background-image: none;\">\n\t<style>\n\t\t#id-6ac86a0bcd320 > .container > .content {\n\t\t\tbackground-color: #eaeef4ff;\n\t\t\tposition: relative;\n\t\t\tpadding-top: 36px;\n\t\t\tpadding-right: 48px;\n\t\t\tpadding-bottom: 36px;\n\t\t\tpadding-left: 48px;\n\t\t\tmargin-left: 0px;\n\t\t\tmargin-right: 0px;\n\t\t}\n\t\t@media (max-width: 1272px) {\n\t\t\t#id-6ac86a0bcd320.box.block.full-width > .container > .content {\n\t\t\t\tpadding-left: 0 !important;\n\t\t\t\tpadding-right: 0 !important;\n\t\t\t\tmargin: 0 !important;\n\t\t\t}\n\t\t}\n\t\t@media (max-width: 960px) {\n\t\t\t#id-6ac86a0bcd320 > .container > .content {\n\t\t\t\t\/\/padding-top: 18px;\n\t\t\t\tpadding-right: 24px;\n\t\t\t\t\/\/padding-bottom: 18px;\n\t\t\t\tpadding-left: 24px;\n\t\t\t}\n\t\t}\n\t<\/style>\n\t<div class=\"container\">\n\t\t<div class=\"content\">\n\t\t\t\n\n<h3 class=\"wp-block-heading has-medium-font-size\"><strong>Learn more about our cooling solutions for custom silicon at the 2026 OCP Global Summit<\/strong><\/h3>\n\n\n<div id=\"block_7e6a68a994ef288142671d2e037f7d68\" class=\"button block\">\n\t<div class=\"container left\">\n\t\t\t\t\t\t<a title=\"Axiom at OCP\" href=\"https:\/\/flex.com\/ocp-global-summit\" target=\"\" class=\"btn-link\">\n\t\t\tAxiom at OCP\t\t\t<div class=\"long-arrow\">\n\t\t\t\t<svg version=\"1.1\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\" xmlns:xlink=\"http:\/\/www.w3.org\/1999\/xlink\" x=\"0px\" y=\"0px\" viewBox=\"0 0 19.9 9.9\" xml:space=\"preserve\">\n\t\t\t\t\t<polygon points=\"15.5,0 14.5,0.9 17.4,4.3 0,4.3 0,5.7 17.4,5.7 14.5,9 15.5,9.9 19.9,5 \"\/>\n\t\t\t\t<\/svg>\n\t\t\t\t<div class=\"line\"><\/div>\n\t\t\t<\/div>\n\t\t<\/a>\n\t\t\t<\/div>\n\t<script>\n\t\twindow.addEventListener('DOMContentLoaded', () => {\n\t\t\t(function ($) {\n\t\t\t\t\/\/ Get the block ID\n\t\t\t\tvar id = \"#block_7e6a68a994ef288142671d2e037f7d68\";\n\t\t\t\t\/\/ Reveal the block\n\t\t\t\tScrollReveal().reveal(id + \" .btn-link\", {origin: \"bottom\", distance: \"20px\", duration: 1000});\n\t\t\t}(jQuery));\n\t\t});\n\t<\/script>\n<\/div>\n\n\t\t<\/div>\n\t<\/div>\n<\/div>\n\n\n\t\t<\/div>\n\t<\/div>\n<\/div>\n","protected":false},"excerpt":{"rendered":"","protected":false},"author":3,"featured_media":43619,"template":"","categories":[86],"tags":[],"content-type":[13],"class_list":["post-43580","resource","type-resource","status-publish","has-post-thumbnail","hentry","category-data-center","content-type-blog"],"acf":[],"_links":{"self":[{"href":"https:\/\/flex.com\/de\/wp-json\/wp\/v2\/resource\/43580","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/flex.com\/de\/wp-json\/wp\/v2\/resource"}],"about":[{"href":"https:\/\/flex.com\/de\/wp-json\/wp\/v2\/types\/resource"}],"author":[{"embeddable":true,"href":"https:\/\/flex.com\/de\/wp-json\/wp\/v2\/users\/3"}],"version-history":[{"count":9,"href":"https:\/\/flex.com\/de\/wp-json\/wp\/v2\/resource\/43580\/revisions"}],"predecessor-version":[{"id":43630,"href":"https:\/\/flex.com\/de\/wp-json\/wp\/v2\/resource\/43580\/revisions\/43630"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/flex.com\/de\/wp-json\/wp\/v2\/media\/43619"}],"wp:attachment":[{"href":"https:\/\/flex.com\/de\/wp-json\/wp\/v2\/media?parent=43580"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/flex.com\/de\/wp-json\/wp\/v2\/categories?post=43580"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/flex.com\/de\/wp-json\/wp\/v2\/tags?post=43580"},{"taxonomy":"content-type","embeddable":true,"href":"https:\/\/flex.com\/de\/wp-json\/wp\/v2\/content-type?post=43580"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}